2023
DOI: 10.1073/pnas.2308804120
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Flexible fluid-based encapsulation platform for water-sensitive materials

Abstract: The next-generation semiconductors and devices, such as halide perovskites and flexible electronics, are extremely sensitive to water, thus demanding highly effective protection that not only seals out water in all forms (vapor, droplet, and ice), but simultaneously provides mechanical flexibility, durability, transparency, and self-cleaning. Although various solid-state encapsulation methods have been developed, no strategy is available that can fully meet all the above requirements. Here, we report a bioinsp… Show more

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Cited by 8 publications
(3 citation statements)
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“…In addition to high conformability and low vapor permeability, such encapsulation must also be biocompatible and have minimal interference on the encapsulated sensor's sensing capabilities and mechanical properties. Recent progress has been made in the employment of different soft materials, such as liquid metals (Shen et al, 2023) and lubricant-infused polymers (Lemaire et al, 2023), in the fabrication of mechanically compliant encapsulation layers, providing potential research directions for the development of highly robust encapsulation of soft mechanical sensors in wearable and implantable settings. 5.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…In addition to high conformability and low vapor permeability, such encapsulation must also be biocompatible and have minimal interference on the encapsulated sensor's sensing capabilities and mechanical properties. Recent progress has been made in the employment of different soft materials, such as liquid metals (Shen et al, 2023) and lubricant-infused polymers (Lemaire et al, 2023), in the fabrication of mechanically compliant encapsulation layers, providing potential research directions for the development of highly robust encapsulation of soft mechanical sensors in wearable and implantable settings. 5.…”
Section: Discussionmentioning
confidence: 99%
“…In addition to high conformability and low vapor permeability, such encapsulation must also be biocompatible and have minimal interference on the encapsulated sensor's sensing capabilities and mechanical properties. Recent progress has been made in the employment of different soft materials, such as liquid metals (Shen et al, 2023) and lubricant‐infused polymers (Lemaire et al, 2023), in the fabrication of mechanically compliant encapsulation layers, providing potential research directions for the development of highly robust encapsulation of soft mechanical sensors in wearable and implantable settings. Large‐scale manufacturing with low device‐to‐device variation: In order to realize commercial and clinical viability, further advancements in the use of scalable manufacturing techniques to fabricate soft mechanical sensors are necessary. While techniques such as inkjet printing and photolithography have already been used to fabricate sensors in a highly scalable way (as discussed in Section 3.7), further exploration of large‐scale manufacturing techniques for a broader range of materials that can enable the different aforementioned human‐compatible properties is required.…”
Section: Discussionmentioning
confidence: 99%
“…The OBC was prepared according to a previous liquid‐solid composite method. [ 57 ] The oil was a mixture of 20 mL palm oil, 20 mL thyme essential oil, and 4 mL cinnamaldehyde (i.e., the volume ratio of palm oil: thyme essential oil: cinnamaldehyde was 5:5:1). Prior to the infusion, the oil mixture was stirred in a conical flask for 2 h at a speed of 500 r min −1 .…”
Section: Methodsmentioning
confidence: 99%