2015
DOI: 10.1016/j.jpcs.2015.04.008
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Flexible fluorescent white organic light emitting diodes with ALD encapsulation

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Cited by 13 publications
(6 citation statements)
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“…The P-NTCFs and CNT/P-NTCFs with different concentrations of CNT solution were made by spin-coating at an optimized speed. The structure and energy-levels of OLEDs are shown in Figure 1b,c [7,12,16,52]. The fabrication steps of the OLEDs were as follows: (1) A copper conductive adhesive used to prepare the anode was stuck on the surfaces of the P-NTCF and CNT/P-NTCF films.…”
Section: Fabrication Of Oledsmentioning
confidence: 99%
“…The P-NTCFs and CNT/P-NTCFs with different concentrations of CNT solution were made by spin-coating at an optimized speed. The structure and energy-levels of OLEDs are shown in Figure 1b,c [7,12,16,52]. The fabrication steps of the OLEDs were as follows: (1) A copper conductive adhesive used to prepare the anode was stuck on the surfaces of the P-NTCF and CNT/P-NTCF films.…”
Section: Fabrication Of Oledsmentioning
confidence: 99%
“…Encapsulating materials is a very interesting area that inorganic flexible glass could also enter due to the characteristics discussed in this paper. This field is important with the contribution of polymers and graphene [ 197 , 198 , 199 , 200 , 201 , 202 , 203 , 204 , 205 , 206 , 207 ], although inorganic flexible glass materials also permeated the area with Willow ® Glass and thin glass/polymer composition using roll-to-roll processing [ 115 , 208 , 209 , 210 ]. However, there is still plenty of room for the inorganic glass influence to grow.…”
Section: Prospective Areas and Closing Remarksmentioning
confidence: 99%
“…The extreme sensitivity of OLED materials and devices to moisture and oxygen demands highly controlled production environments together with defect‐free encapsulation technologies, including single‐barrier thin‐film encapsulation (TFE) methods such as atomic layer deposition [ 26–30 ] or chemical vapor deposition (CVD) [ 30–32 ] as well as multibarrier TFE methods that entail the repeated stacking of organic/polymeric and inorganic layers. [ 9,33–35 ] Nevertheless, such TFE methods, which are mainly associated with protection against oxidation and delamination of the metal cathode at the cathode/organic interface, have led to complicated fabrication processes and thus increased production costs.…”
Section: Introductionmentioning
confidence: 99%