Flexible Microcircuit of a Liquid Metal Deposit Layer

Abstract

Liquid metal (LM) is of great use in many fields (e. g., sensors, biology, electronic circuits). With special mobility, high surface tension and excellent electrical conductivity, it can play a role in the field of flexible electronics. Due to its surface tension, it easily shrinks into a spheroid shape. Especially under the same current condition, the shrinkage of the volume will lead to open circuit, so it is very difficult to produce stable liquid metal ultrathin, ultrafine wire, which has become a barrier limiting the use of liquid metal. In this work, LM is mixed with polydimethylsiloxane to form a micrometer‐thick conductive layer by free deposition. The LM is located inside the polymer holes. Not only that, microcircuits are also mapped on the surface of LM deposits. It not only has excellent electrical conductivity, but also has good flexibility. This work explores a simple method to produce a ultrathin conductive film and reduce the size of electronic components, which has potential applications in integrated circuits.

Novel Conductive AgNP-Based Adhesive Based on Novel Poly (Ionic Liquid)-Based Waterborne Polyurethane Chloride Salts for E-Textiles

“…Metallic nanoparticles with high electrical conductivity and high stability, such as silver nanoparticles (AgNPs), have attracted great interest in flexible electronics [ 16 , 17 , 18 , 19 ]. The stable dispersion of AgNPs in various solvents makes it very easy to generate a stable conductive ink, and the AgNPs have high compatibility with polymer-based adhesives (epoxy-based, acrylic-based, polyurethane-based, etc.)…”