“…There are 10 papers published in this Special Issue, covering new strategies for a paradigm shift in the design [ 1 , 2 , 3 ], fabrication [ 4 , 5 , 6 , 7 ], and encapsulation [ 8 , 9 , 10 ] of next-generation flexible systems. Xiao et al [ 1 ] proposed an “island-bridge” strategy to design high-performance stretchable electronics composed of inorganic rigid components so that that can they can be conformally transferred to non-developable surfaces.…”