Flip-Chip-Assembled Air-Suspended Inductors

Bell, Patrick; Høivik, Nils; Saravanan, R.; Ehsan, Negar; Bright, Victor M.; Popović, Zoya

doi:10.1109/tadvp.2006.890227

Cited by 13 publications

(5 citation statements)

References 14 publications

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“…This design considers the above factors and takes care of the trade-offs involved in selecting the number of turns, the separation distance between each turn, and the width of metalization needed for the inductor to act as the AC decoupling component. To implement the dedicated onchip bias-tee, electromagnetic simulations may be required when custom inductors are necessary [265], [266].…”

Section: Stno/shno-based Applications: Issues Challenges and Devmentioning

confidence: 99%

Spin-Torque and Spin-Hall Nano-Oscillators

et al. 2016

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This paper reviews the state of the art in spin-torque and spin Hall effect driven nano-oscillators. After a brief introduction to the underlying physics, the authors discuss different implementations of these oscillators, their functional properties in terms of frequency range, output power, phase noise, and modulation rates, and their inherent propensity for mutual synchronization. Finally, the potential for these oscillators in a wide range of applications, from microwave signal sources and detectors to neuromorphic computation elements, is discussed together with the specific electronic circuitry that has so far been designed to harness this potential.

QS 2016

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Section: Stno/shno-based Applications: Issues Challenges and Devmentioning

confidence: 99%

Spin-Torque and Spin-Hall Nano-Oscillators

et al. 2016

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QS 2016

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“…The main advantages of this approach are the process simplicity and feasibility and the lower manufacturing costs compared to top-down microfabrication processing. Chip-to-chip bonding techniques such as flip-chip bonding could also be used to realize complex inductor windings by bonding chips, such as suspended spiral inductors 70 .…”

Section: D Surface Micromachiningmentioning

confidence: 99%

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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“…Equation ( 10) is analogous to (7), except that it corresponds to the equivalent configuration where the objects have been replaced by the surrounding medium [26]. To obtain (10), n × E ( r) was expanded with BC functions, and the AEFIE was tested with n × RWG and pulse functions, as in the original configuration.…”

Section: A Internal Problemmentioning

confidence: 99%

“…Next, we generalize the proposed formulation (18) to the case of structures containing multiple disjoint objects, which is easily accomplished with a block-diagonal concatenation of the internal problem matrices. Suppose that A represents any of the blocks in the matrices in (7) or (10). For multiple objects, we may write…”

Section: Structures With Multiple Objectsmentioning

confidence: 99%

A Single-Layer Dual-Mesh Boundary Element Method for Multiscale Electromagnetic Modeling of Penetrable Objects in Layered Media

Sharma¹,

Triverio²

2021

IEEE J. Multiscale Multiphys. Comput. Tech.

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A surface integral representation of Maxwell's equations allows the efficient electromagnetic (EM) modeling of threedimensional structures with a two-dimensional discretization, via the boundary element method (BEM). However, existing BEM formulations either lead to a poorly conditioned system matrix for multiscale problems, or are computationally expensive for objects embedded in layered substrates. This article presents a new BEM formulation which leverages the surface equivalence principle and Buffa-Christiansen basis functions defined on a dual mesh, to obtain a well-conditioned system matrix suitable for multiscale EM modeling. Unlike existing methods involving dual meshes, the proposed formulation avoids the double-layer potential operator for the surrounding medium, which may be a stratified substrate requiring the use of an advanced Green's function. This feature greatly alleviates the computational expense associated with the use of Buffa-Christiansen functions. Numerical examples drawn from several applications, including remote sensing, chip-level EM analysis, and metasurface modeling, demonstrate speed-ups ranging from 3× to 7× compared to state-of-the-art formulations.

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Flip-Chip-Assembled Air-Suspended Inductors

Cited by 13 publications

References 14 publications

Spin-Torque and Spin-Hall Nano-Oscillators

Spin-Torque and Spin-Hall Nano-Oscillators

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

A Single-Layer Dual-Mesh Boundary Element Method for Multiscale Electromagnetic Modeling of Penetrable Objects in Layered Media

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