Flip chip based on compliant double helix interconnect for high frequency applications

Abstract

Compliant interconnects are a viable solution for coefficient of thermal expansion (CTE) mismatch failures and it is therefore important to understand their performance at high frequency. In this work, we present double helix shaped compliant interconnects that are designed and fabricated on top of a coplanar waveguide (CPW) test structure followed by flip chip bonding. The high frequency performance of compliant double helix interconnect is simulated and measured. The measured insertion and reflection loss were less than -0.6 dB and -15 dB up to 50 GHz, respectively.