Flip-Chip Interconnection to Various Substrates Using Anisotropic Conductive Adhesive Films

Watanabe, Ikumu; Takemura, Kentaro; Shiozawa, Naoyuki; Watanabe, Osamu; Kojima, Kazuyoshi; Ohta, Tomohisa

doi:10.1142/s0960313195000281

Cited by 21 publications

(9 citation statements)

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“…Furthermore, ACF base flip chip technology is lead free and environmentally friendly [2]. During previous mechanical analyzes [3]- [7], it was learned that the advantage of using the ACF package was affected by the interconnect reliability under different real life testing scenarios.…”

Section: Introductionmentioning

confidence: 99%

Transient thermal analysis of an ACF package assembly process

Chiriac¹,

Lee²

2001

IEEE Trans. Comp. Packag. Technol.

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Transient thermal simulation was performed to analyze thermal response of the assembly process for a package using anisotropic conductive film (ACF). The main purpose of the study is to simulate the actual assembly and manufacturing process, in order to provide a first-hand approximation and insight of the thermal behavior of the package and ACF film during the process. Two assembly processes were modeled: a simplified process where the package was fixed at two different temperatures during assembly, and a detailed process where the package experienced a ramping heating process, followed by a constant temperature curing process.A full convection-conduction case was conducted first. The results indicate a weak hydrodynamic field and radiation effects, hence for computational purposes (reduced CPU time), it was decided to model the process using a conduction-only investigation.Results from the detailed process modeling indicated that during the initial ramping, within 0.02 s, the die and nozzle head experienced a small temperature drop due to the cooling effect of the ACF material and substrate. The ACF material also displayed a steep increase in temperature after contacting the die, followed by a short decay, then ramped up again. At the end of the 10-s ramping process, the ACF reached a temperature of almost 203 C, while the die was at 206 C. During the 5 s of curing, all parts reached steady state in less than 2 s.

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Section: Introductionmentioning

confidence: 99%

Transient thermal analysis of an ACF package assembly process

Chiriac¹,

Lee²

2001

IEEE Trans. Comp. Packag. Technol.

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“…In this experiment, ACF type package is employed for monitoring the crack length (15) (16) . This ACF has a general polymer matrix and a glass transition temperature of 113 o C.…”

Section: Specimensmentioning

confidence: 99%

Health Monitoring for Electronic Package Using a Simple Moire Interferometry

Park

Lee

2008

JMMP

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Like a diagnosis of human body, it is important to monitor conditions of electronic packages in use. Even if electronic packages are sound in the beginning, thermal cycles during operations can produce fatigue cracks that lead to the system failure eventually. If we know the crack length in the package in real-time, a fatal damage can be prevented before the system failure. Currently, there are no simple methods for real-time monitoring of electronic packages in use. In this research, we propose a non-destructive monitoring method that detects the crack length in electronic packages. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformation on the chip side is changed. Therefore, we can measure these micro deformations by using Moiré interferometry and find out the crack length. The proposed monitoring method is applied to ACF type package specimens. Experimental results show that the crack length of the electronic package affects the thermal deformation of the chip. If we have data of thermal strain by a specific crack length, we can monitor the crack length in real-time. Since the failure of a super-computer or network-server system affect the tremendous damage, we must know the health conditions of electronic packages in real-time. This research focuses the health monitoring of the electronic package of these system.

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“…Since ICA serve as solder replacement (lower processing temperatures, lead free properties), similar assembly procedures like screen and sten- [8,9], pick & place operation, underfilling and the reflow/curing process are used. Originally developed for the driver 1C assembly on LCD panels (Chip-on-glass, ITO) [12,13], today ACA is applied as well to low cost electronics (e.g. 2.4A) [10].…”

Section: Flip Chip Processingmentioning

confidence: 99%