Flip-chip packaging solution for CMOS image sensor device

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

“…Recently, a COF bonding technology using a non-conductive adhesive (NCA) has been developed, which provides a simple and engaging solution for very fine pitch interconnections. Gold stud bumps, electroless Au/Ni bumps and electroplated Au bumps have been used [4][5][6][7][8]. However, these fail to meet the increasing requirements for low cost because Au is very expensive.…”