Flip-Chip Underfill: Materials, Process, and Reliability

Zhang, Zhuqing; Zhu, Pengli; Wong, C.P.

doi:10.1007/978-3-319-45098-8_8

Cited by 10 publications

(6 citation statements)

References 65 publications

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“…[1][2][3][4] In electronic packaging industry, the spherical particle, for example, SiO 2 , Al 2 O 3 , reinforced epoxy composites, such as underfill, epoxy molding compound (EMC), exhibiting improved properties in modulus, toughness, thermal stability, and coefficient of thermal expansion, and have been wildly used in traditional and advanced packaging. [5][6][7][8] As the development of packaging technology, the demand for higher performance packaging material has also increased. Therefore, a fundamental understanding of how spherical particle affect the properties of reinforced epoxy composite is of significant interest in packaging material design and application.…”

Section: Introductionmentioning

confidence: 99%

“…Particulate reinforced polymer composite, which consists of reinforcing particles and polymer matrix, exhibit improved thermal, mechanical, electronical, and magnetic properties, and has greatly extended the application of polymer material in electronic, mechanical, biological, and environmental science and engineering 1–4 . In electronic packaging industry, the spherical particle, for example, SiO 2 , Al 2 O 3 , reinforced epoxy composites, such as underfill, epoxy molding compound (EMC), exhibiting improved properties in modulus, toughness, thermal stability, and coefficient of thermal expansion, and have been wildly used in traditional and advanced packaging 5–8 . As the development of packaging technology, the demand for higher performance packaging material has also increased.…”

Section: Introductionmentioning

confidence: 99%

“…The CTE of packaging material is an important parameter in determining the reliability of electronic packaging, 7,9,10 and model‐based CTE modulation and optimization is indispensable for high‐end material design and application. So far, theoretical modeling and equations for predicting the CTE of particle‐reinforced composite have been extensively studied and discussed, several equations for predicting the CTE of composite have been reported 11–18 .…”

Section: Introductionmentioning

confidence: 99%

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A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

Peng,

Zhang,

Fan

et al. 2024

Polymer Composites

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Modeling and theoretical prediction of thermal expansion property of particulate reinforced polymer composite are important hot issues in composite science and engineering. In this article, the thermomechanical interaction between spherical particle and polymer matrix and its contribution to the thermal expansion behavior of spherical particle reinforced polymer composite have been studied theoretically. A mechanical interphase resulted from the thermomechanical interaction is observed in radial distribution of effective coefficient of thermal expansion (CTE) around the particle with an isotropic assumption of the particle and polymer matrix, and with necessary simplification of the thermomechanical interference among particles, an analytical equation for predicting the CTE of the composite has been proposed. Compared with other models, good fits by this model with finite element (FE) simulated CTE value of particle reinforced composite and previously reported CTE data of particulate reinforced epoxy composites with particle size from micron to nanometer scale are observed. This study would deepen the understanding of the interphase in particle reinforced composites and be favorable for mechanism analysis of other physical properties of polymer composites.Highlights Thermomechanical interaction between spherical particle and matrix is studied A new model for the CTE of particle reinforced polymer composite is proposed FE simulation been carried out to examine the reasonability of the proposed model Present model well fits the reported reinforced epoxy composites CTE data A new perspective for analyzing other properties of reinforced composites

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

Peng,

Zhang,

Fan

et al. 2024

Polymer Composites

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“…Conversely, pad-type TIMs are a soft solid form of film composed of a silicone or polymer matrix with embedded metal fillers. The pad-type TIMs are easy to assemble and disassemble and accommodate non-flat interfaces between heat sources and heat sinks [ 7 ].…”

Section: Introductionmentioning

confidence: 99%

The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials

Lee,

Akyildiz,

Kang

et al. 2023

Polymers

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Pad-type thermal interface materials (TIMs) with composite structures are required to exhibit high thermal conductivity while maintaining conformal contact with the heat sink, which is strongly influenced by the type and content of the thermally conductive filler. This study presents that biphasic metal particles can be effectively aligned using the dielectrophoretic chaining (DEP-C) mechanism, thereby enhancing the thermal conductivity of a pad-type TIM. A eutectic gallium–indium (EGaIn) alloy liquid metal and solid copper were used as the filler materials with two different phases. The biphasic metal particle mixture of EGaIn and Cu (EGaIn-Cu) were better aligned by DEP-C than when they presented individually because fusion between the two particles increased the effective size. As expected, the thermal conductivity of the TIM composites increased when DEP-C aligned the filler. Notably, TIMs with both EGaIn-Cu fillers showed the largest increase in thermal conductivity, of up to 64.6%, and the highest thermal conductivity values after DEP-C application compared to TIMs with only the EGaIn or Cu filler. Finally, the heat dissipation performance of the TIM composite on a lit light-emitting diode is shown, where the TIM with DEP-C-aligned fillers exhibits improved performance.

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“…The interfacial bonding integrity between polymer and other materials is critical in achieving proper functionality in many engineering devices . For example, bonding strength between the polymeric packaging materials and the silicon integrated circuits largely determines the reliability of the microelectronic devices .…”

Section: Introductionmentioning

confidence: 99%

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Huang

Meng

et al. 2022

ACS Appl. Mater. Interfaces

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Interfacial bonding integrity between different materials is critical to maintain the functionality of the entire physical system in any scale, ranging from building structures down to semiconductor transistors. For example, micro-patterned polymers embedded with conductive nanoparticles [e.g., carbon nanotubes (CNTs)] bonded with integrated circuits have been applied as many emerging chemical/biological microelectronic sensors. Nonetheless, it is challenging to measure and ensure the interfacial bonding integrity between materials for consistent and sustainable operations. Herein, we apply multiple interface characterization methods based on micro-engineering and microscopy as an integrative approach to reveal the mechanism of interfacial reinforcement by adding CNTs in a matrix material. An epoxy/CNT micro-beam is fabricated onto a silicon substrate, sandwiching a gold layer as an interfacial precrack. Superlayers of chromium are then repeatedly deposited onto the microstructure, inducing stepwise increasing stress over the materials and the corresponding micro-beam bending after detachment from the bonded interface. Accordingly, we can quantify key interfacial fracture parameters such as crack length, steady-state energy release rate, and fracture toughness. By further examining the formation and distribution of the micro-/nanostructures along the debonded interface using bright-field microscopy, 3D fluorescence imaging, and scanning electron microscopy, we can identify the underlying dominant interfacial strengthening and fracture toughening mechanisms. We further compare experimental results and theoretical predictions to quantify the interfacial bonding properties between epoxy/CNT and silicon and unveil the underlying reinforcement mechanisms. The results provide insights to develop polymer/nanoparticle composites with reinforced interfacial bonding integrity for more sustainable and reliable applications including microelectronics, surface coatings, and adhesive materials.

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Flip-Chip Underfill: Materials, Process, and Reliability

Cited by 10 publications

References 65 publications

A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

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