Flow Boiling Heat Transfer and Heat Conduction Analysis of High-Power Electronic Devices

Abstract

A flow boiling experiment in a narrow channel was conducted using subcooled water. Moreover, the experimentally measured heat flux of the channel was applied for the heat conduction analysis of insulated gate bipolar transistors (IGBTs). The relationship between the heat flux and the temperature difference was investigated experimentally, ranging from nonboiling to boiling in the narrow tube. The boiling heat transfer in the fully nucleate boiling region was validated by comparing with the Rohsenow correlation. Moreover, the measured critical heat flux (CHF) agreed with the Hall and Mudawar correlation within ± 15%. The heat conduction analysis of an IGBT module with a heatsink was solved using the measured heat flux in the narrow channel as a boundary condition, applied from the nonboiling region to the film boiling region. The thermal resistance of the material was obtained when the heatsink with narrow channels was modeled. The numerical result indicated that the thermal resistance of the material was influenced by the heat transfer process of the cooling channel.

Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation

“…The obtained results are presented in Figures 4 and 5. Combining the simulation results with literature [24], it can be concluded that the heat generated during chip operation mainly transfers from the top to the bottom in an emissive pattern toward the substrate and dissipates through the heat sink. Due to the different thermal conductivity of each layer's material, the temperature distribution between the internal layers of the module exhibits a gradient variation, which directly affects the distribution of thermal stress within the module.…”