1998
DOI: 10.1016/s1359-6454(97)00230-9
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Flow stress of f.c.c. polycrystals with application to OFHC Cu

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Cited by 223 publications
(136 citation statements)
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“…As the strain rate increases from quasi-static conditions to approximately 10 3 s À1 , a linear relationship is maintained between the flow stress and the logarithm of the strain rate. 1,2) Deformation at these strain rates has been well explained by the mechanism of thermal activation of dislocations over short-range barriers.…”
Section: Introductionmentioning
confidence: 94%
“…As the strain rate increases from quasi-static conditions to approximately 10 3 s À1 , a linear relationship is maintained between the flow stress and the logarithm of the strain rate. 1,2) Deformation at these strain rates has been well explained by the mechanism of thermal activation of dislocations over short-range barriers.…”
Section: Introductionmentioning
confidence: 94%
“…A modi®ed version of this model has been successfully applied to OFHC copper by Nemat-Nasser and Li (1998). The model uses the basic concept that the resistance to the motion of dislocations, introduced by various microstructural barriers, de®nes the¯ow stress of metals (Kocks et al, 1975;Follansbee and Kocks, 1988;Follansbee and Gray III, 1989).…”
Section: A Physically Based Model For Dynamic Response Of Vanadiummentioning
confidence: 99%
“…Thus, it is inferred that 6061-T6 alloy has good ductility and strengthening properties under cryogenic temperatures and high strain rates. Figure 3(d) compares the stress-strain response of the current 6061-T6 alloy with that of Al-4Cu-0.5Zr, 25) UFGCu, 26) OFHC-Cu 27) and 3003 Al-Mn 28) under broadly equivalent loading conditions. The results show that the flow stress of 6061-T6 alloy is higher than that of UFG-Cu, OFHC-Cu and 3003 Al-Mn, but lower than that of Al-4Cu-0.5Zr.…”
Section: ¹1mentioning
confidence: 99%