Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium

Farsad, E.; Abbasi, Seyed Peyman; Zabihi, Majed

doi:10.1115/1.4025823

Cited by 21 publications

(4 citation statements)

References 19 publications

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“…In order to study the effects of disturbance in the micro-channels, researchers build turbulent micro structures in the micro-channel, which improve the heat exchange efficiency and realize the consistency of flow rate [ 14 , 15 ]. The liquid working as coolant for micro-channel is also studied, and the heat capacity, thermal conductivity and viscosity all significantly affect the cooling capacity of the micro-channel [ 16 , 17 ]. In addition, the phase change mechanism may be employed to realize a two-phase micro fluid channel heat sink, which further improves its heat dissipation capability [ 18 ].…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors

Wang

et al. 2018

Sensors

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A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). However, the understanding of such a micro-channel device is not sufficient, because the tools for studying it are very limited. The details inside the micro-channels are not readily available. In this letter, a micro-channel heat sink is comprehensively studied using the integrated temperature sensors. The highly sensitive thin film temperature sensors can accurately monitor the temperature change in the micro-channel in real time. The outstanding heat dissipation performance of the micro-channel heat sink is proven in terms of maximum temperature, cooling speed and heat resistance. The temperature profile along the micro-channel is extracted, and even small temperature perturbations can be detected. The heat source formed temperature peak shifts towards the flow direction with the increasing flow rate. However, the temperature non-uniformity is independent of flow rate, but solely dependent on the heating power. Specific designs for minimizing the temperature non-uniformity are necessary. In addition, the experimental results from the integrated temperature sensors match the simulation results well. This can be used to directly verify the modeling results, helping to build a convincing simulation model. The integrated sensor could be a powerful tool for studying the micro-channel based heat sink.

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Section: Introductionmentioning

confidence: 99%

A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors

Wang

et al. 2018

Sensors

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“…Such analyses by Hung et al [13,14] indicated that the demerit of high pumping power requirement for flow through microchannels filled with sintered porous material could be alleviated by providing height or width enlargement to the channels. Numerical results of Farsad et al [15] and Shen et al [16] exhibited a more uniform sink temperature profile provided by microchannels partially filled by porous metal foam. Shen et al [16] validated their model against the results of Calmidi and Mahajan [17] for low Re flow through a continuous foam structure.…”

Section: Motivationmentioning

confidence: 91%

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

2019

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Since the realization of microchannel devices more than three and half decades ago with water as the cooling fluid providing heat transfer enhancement, significant progress has been made to improve the cooling performance. Thermal management for electronic devices with their ever-widening user profile remains the major driving force for performance improvement in terms of miniaturisation, long-term reliability, and ease of maintenance. The ever-increasing requirement of meeting higher heat flux density in more compact and powerful electronic systems calls for further innovative solutions. Some recent studies indicate the promise offered by processes with phase change and the use of active devices. But their adoption for electronic cooling still weighs unfavourably against long-term fluid stability and simplicity of device profile with moderate to high heat transfer capability. Applications and reviews of these promising research trends have been briefly visited in this work. The main focus of this review is the flow and heat transfer regime related to electronic cooling in evolving channel forms, whose fabrication are being enabled by the significant advancement in micro-technologies. Use of disruptive wall structures like ribs, cavities, dimples, protrusions, secondary channels and other interrupts along with smooth-walled channels with curved flow passages remain the two chief geometrical innovations envisaged for these applications. These innovations target higher thermal enhancement factor since this implies more heat transfer capability for the same pumping power in comparison with the corresponding straight-axis, smooth-wall channel configuration. The sophistication necessary to deal with the experimental uncertainties associated with the micron-level characteristic length scale of any microchannel device delayed the availability of results that exhibited acceptable matching with numerical investigations. It is indeed encouraging that the experimental results pertaining to simple smooth channels to grooved, ribbed and curved microchannels without unreasonable increase in pumping power have shown good agreement with conventional numerical analyses based on laminar-flow conjugate heat-transfer model with no-slip boundary condition. The flow mechanism with the different disruptive structures like dimple, cavity and rib, fin and interruption, vortex generator, convergingdiverging side walls or curved axis are reviewed to augment the heat transfer. While the disruptions cause heat transfer enhancement by interrupting the boundary layer growth and promoting mixing by the shed vortices or secondary channel flow, the flow curvature brings in enhancement by the formation of secondary rolls culminating into chaotic advection at higher Reynolds number. Besides these revelations, the numerical studies helped in identifying the parameter ranges, promoting a particular enhancement mechanism. Also, the use of modern tools like Poincare section and the analysis of flow bifurcation leading to chaotic advection is discussed....

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“…Microchannel heat sinks filled with metal foam were investigated numerically by E. Farsad et al [15]. Results showed that microchannel heat sinks filled with copper foam could achieve better temperature uniformity.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink

et al. 2022

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Thermal management at a high heat flux is crucial for high-power electronic devices, and jet impingement cooling is a promising solution. In this paper, a hybrid heat sink combining a microchannel and jet impingement was designed, fabricated and tested in a closed-loop system with R134a as the working fluid. The thermal contact resistance was measured by using the steady-state method, and the thermal resistance of the heat sink was obtained at different heat fluxes and flow rates. The maximum heat dissipation of 400 W/cm2 is achieved on a heater area of 210 mm2, and the thermal resistance of the heat sink is 0.11 K/W with a pressure drop of 13.5 kPa under a flow rate of 1.90 L/min. Low thermal resistance can be achieved for the hybrid heat sink stemming from the highly-dense micro-jet array with separate inflow and outflow microchannels.

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Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium

Cited by 21 publications

References 19 publications

A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors

A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink

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