Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug‘n’play functionality

Lab-on-a-chip devices: How to close and plug the lab?

“…They demonstrated reliable operation for pressures up to 1 MPa [166]. Later, another ''plug and play'' type of interconnection technique was introduced by Perozziello et al [167]. They integrated custom-made PDMS rings in PMMA microfluidic chips and demonstrated 750 kPa pressure capability and reusability for inserted metal tubings.…”

Tools for the Design of Miniaturized Analytical Systems

“…Packaging also includes the protection of the microsystem from humidity and the possible introduction of foreign species, as well as the sealing techniques to assure hermeticity and structural integrity. A new fluidic interconnection approach for packaging of microsystems has recently been proposed by O. Geschke and coworkers [125]. D. Erickson and D. Li reviewed the integrated microfluidic devices for a broad range of application areas [122].…”

A highly reliable integrated PDMS interconnector with a long cast flange for microfluidic systems

“…Creating reliable interconnectors linking microfluidic systems to the macro world has been a great challenge in this field due to the differences both in scale and fabrication technologies (Whitesides 2006;Thorsen et al 2002;Fredrickson and Fan 2004). Therefore a wide variety of interconnection methods have been proposed (Meng et al 2001;Tsai and Lin 2001;Korivi and Jiang 2007;Gray et al 2004;Nittis et al 2001;Pattekar and Kothare 2003;Dalton and Karan 2007;Perozziello et al 2008).…”

“…Furthermore, this kind of permanent interconnection is time consuming in the alignment and assembly process. In order to overcome the disadvantages of this permanent interconnection, reversible interconnections were developed (Zhen and Maeda 2003;Snakenborg et al 2007;Sabourin et al 2009;Nittis et al 2001;McDonald and Whitesides 2002;Zhen and Maeda 2002;Puntambekar and Ahn 2002;Pattekar and Kothare 2003;Bhagat et al 2007Perozziello et al 2008Yao et al 2000;Peles et al 2004;Lee et al 2004;Chiou and Lee 2004;Pepper et al 2007;Christensen et al 2005;Dalton and Karan 2007).…”

“…Recently, integrated interconnections have attracted more attention; they can be subdivided into press-fit and soft intermediate types. The latter mainly uses membrane gaskets (Nittis et al 2001;McDonald and Whitesides 2002) and O-rings (Zhen and Maeda 2002;Puntambekar and Ahn 2002;Pattekar and Kothare 2003;Bhagat et al 2007Perozziello et al 2008Yao et al 2000) to achieve good sealing. However, there are still considerable problems with such soft intermediate interconnectors.…”