Fluidic self-assembly for MicroLED displays by controlled viscosity

Lee, D.; Cho, Seongkyu; Park, Cheolheon; Park, Kyung Ryoul; Lee, Jongcheon; Nam, Jaewook; Ahn, Kwangguk; Park, C.S.; Jeon, Kiseong; Yuh, Hwan-Kuk; Choi, Wonseok; Lim, Chung Hyun; Kwon, Tae-Kyu; Min, Young Hwan; Joo, Minho; Choi, Yoon-Ho; Lee, Jeong Soo; Kim, Changsoon; Kwon, Sunghoon

doi:10.1038/s41586-023-06167-5

Cited by 34 publications

(10 citation statements)

References 34 publications

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“…By reducing the binding site spacing, which is the distance between components on a PCB of the same area, more components can be arranged. If FSA technology is used for component assembly, it takes less than 1 min for thousands of components to be completely assembled [ 6 , 13 , 20 ]. In this respect, FSA is a way to list more components quickly and easily.…”

Section: Resultsmentioning

confidence: 99%

“…Fluidic self-assembly (FSA) technology allows for components to naturally interact and assemble within the fluid to form a desired structure by using the movement of fluid [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. An irreversible bond is formed between a particle and an assembled substrate coated with molten alloy when a component comes into contact with one of the binding sites.…”

Section: Introductionmentioning

confidence: 99%

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Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Park,

Yoo,

Hong

et al. 2024

Micromachines

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This manuscript presents a comprehensive study on the assembly of microchips using fluidic self-assembly (FSA) technology, with a focus on optimizing the spacing between binding sites to improve yield and assembly. Through a series of experiments, we explored the assembly of microchips on substrates with varying binding site spacings, revealing the impact of spacing on the rate of undesired chip assembly across multiple sites. Our findings indicate a significant reduction in incorrect assembly rates as the spacing increases beyond a critical threshold of 140 μm. This study delves into the mechanics of chip alignment within the fluid medium, hypothesizing that the extent of the alloy’s grip on the chips at different spacings influences assembly outcomes. By analyzing cases of undesired assembly, we identified the relationship between binding site spacing and the area of chip contact, demonstrating a decrease in the combined left and right areas of chips as the spacing increases. The results highlight a critical spacing threshold, which, when optimized, could significantly enhance the efficiency and precision of microchip assembly processes using FSA technology. This research contributes to the field of microcomponent assembly, offering insights into achieving higher integration densities and precision in applications, such as microLED displays and augmented reality (AR) devices.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Park,

Yoo,

Hong

et al. 2024

Micromachines

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“…To assist the transfer, Micro-LEDs are commonly patterned in a manner such that they are weakly suspended on the growth substrate by using anchors or undercut microstructures [7] . Other popular methods include laser-based [6,58] or fluid-assisted micro-assembly [55,59] , which have competing advantages in terms of the transfer speed. While most of them do work for transfer printing microscale devices to planar surfaces, some present poor combability for integrating Micro-LEDs onto a flexible or curvy substrate, primarily because the conventional planar stamps are difficult to be in conformal contact with the curvy/flexible surface.…”

Section: Micro-assemblymentioning

confidence: 99%

Shape-deformable Micro-LEDs for advanced displays and healthcare

Zou,

Li,

Gong

2024

Soft Sci

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Recently, flexible/stretchable micro-scale light-emitting diodes (LEDs), with dimensions significantly smaller than conventional diodes used for illuminations, have emerged for promising applications in areas such as deformable displays, wearable devices for healthcare, etc . For such applications, these devices must have some unusual features that common inorganic LEDs do not intrinsically own, including conformability, biocompatibility, mechanical flexibility, etc . This Perspective focuses on summarizing the most recent progress in developing such flexible emitters based on inorganic semiconductors, followed by reviewing their potential applications. Finally, major challenges and future research directions of deformable micro-scale LEDs are presented.

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“…Micro-LED − displays are gaining momentum in the display community as a promising display technology due to their potential applications, − which include flexible wearable electronic display devices, augmented reality/virtual reality (AR/VR), miniature projectors, and ultrahigh-definition televisions . Semiconductor quantum dot fluorescent nanomaterials − can be used as color conversion layers (CCLs) for full-color micro-LED displays for the purpose of converting the monochromatic light from the background micro-LED chip arrays to primary colors .…”

Section: Introductionmentioning

confidence: 99%

Electrohydrodynamic Inkjet Printing of Three-Dimensional Perovskite Nanocrystal Arrays for Full-Color Micro-LED Displays

Chen,

Yang,

Fan

et al. 2024

ACS Appl. Mater. Interfaces

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Perovskite nanocrystal (PeNC) arrays are showing a promising future in the next generation of micro-light-emitting-diode (micro-LED) displays due to the narrow emission linewidth and adjustable peak wavelength. Electrohydrodynamic (EHD) inkjet printing, with merits of high resolution, uniformity, versatility, and cost-effectiveness, is among the competent candidates for constructing PeNC arrays. However, the fabrication of red light-emitting CsPbBr x I (3−x) nanocrystal arrays for micro-LED displays still faces challenges, such as low brightness and poor stability. This work proposes a design for a red PeNC colloidal ink that is specialized for the EHD inkjet printing of three-dimensional PeNC arrays with enhanced luminescence and stability as well as being adaptable to both rigid and flexible substrates. Made of a mixture of PeNCs, polymer polystyrene (PS), and a nonpolar xylene solvent, the PeNC colloidal ink enables precise control of array sizes and shapes, which facilitates on-demand micropillar construction. Additionally, the inclusion of PS significantly increases the brightness and environmental stability. By adopting this ink, the EHD printer successfully fabricated full-color 3D PeNC arrays with a spatial resolution over 2500 ppi. It shows the potential of the EHD inkjet printing strategy for high-resolution and robust PeNC color conversion layers for micro-LED displays.

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Fluidic self-assembly for MicroLED displays by controlled viscosity

Cited by 34 publications

References 34 publications

Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Shape-deformable Micro-LEDs for advanced displays and healthcare

Electrohydrodynamic Inkjet Printing of Three-Dimensional Perovskite Nanocrystal Arrays for Full-Color Micro-LED Displays

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