Fluorine Substitution Effect on the Material Properties in Transparent Aromatic Polyimides

Peng, Weifeng; Lei, Huanyu; Zhang, Xinxin; Qiu, Luhao; Huang, Mingjun

doi:10.1007/s10118-022-2702-8

Cited by 35 publications

(17 citation statements)

References 39 publications

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“…There are two main reasons for these results. First, the introduction of electron absorbing large volume trifluoromethyl groups (−CF 3 ) and bulkier side tert ‐butyl groups disrupts the polymer chain packing and reduces the formation of intermolecular CTCs 29,47 . Second, the introduction of TPC reduces the proportion of imide groups in the PEsAI chain and weakens the charge‐transfer effect 34 …”

Section: Resultsmentioning

confidence: 99%

“…25,26 Among these, the introduction of the −CF 3 group with large free volume is one of the most effective ways to reduce the CTC. Commercialized available monomers prepared by this strategy include 2,2 0 -bis(trifluoromethyl)biphenyl-4,4 0 -diamine (TFMB), 27 bis(4-amino-2-trifluoromethylphenyl)ether (TFODA), 23,28 4,4 0 -(hexafluoroisopropylidene)diphthalic anhydride (6FDA) 29,30 and so on.…”

Section: Introductionmentioning

confidence: 99%

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Synthesis and properties of transparent poly(ester‐amide‐imide)s from tert‐butylhydroquinone bis(trimellitate anhydride) and p‐phthaloyl chloride

Wen

Chen

et al. 2023

Polymer International

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Two series of poly(ester‐amide‐imide)s (PEsAIs) with simultaneously bulky side groups, ester and amide bonds were synthesized by copolymerization of tert‐butylhydroquinone bis(trimellitate anhydride), p‐phthaloyl chloride and other monomers. These PEsAIs had glass transition temperatures (Tgs) in the range of 231–301 °C, coefficients of thermal expansion (CTEs) of 17–59 ppm K−1 and displayed good mechanical properties with tensile modulus of 2.6–4.5 GPa, tensile strengths of 63–143 MPa and elongations at break of 3.0%–11.7%. All films had good transparency with transmittances at 400 nm (T400nm) of 43%–80%. The introduction of p‐phthaloyl chloride successfully improved the properties of the polymer with higher transmittance, higher Tg and lower CTE. In particular, PEsAI‐b‐60 presented the best comprehensive performance with a moderate Tg of 301 °C, low CTE of 17 ppm K−1 and high transmittance (T400nm) of 75%. © 2023 Society of Industrial Chemistry.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of transparent poly(ester‐amide‐imide)s from tert‐butylhydroquinone bis(trimellitate anhydride) and p‐phthaloyl chloride

Wen

Chen

et al. 2023

Polymer International

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“…The CT is usually quantified by the energy gap calculation. 8,9,[43][44][45] As shown in Fig. 5a and Fig.…”

Section: Quantitative Charge Transfer and The Correlation With Optica...mentioning

confidence: 86%

“…S7. † 9,24,25 DFT simulations are all re-calculated following the same settings in this work. Combining the 18 groups' data (6 in this work and 12 from previous literature), the correlation of experimental and simulated results (λ cutoff , T 400 , E g and E ex ) is plotted in Fig.…”

Section: Papermentioning

confidence: 99%

“…The fundamental design strategy to obtain CPIs is inhibiting or even eliminating the formation of intra- or inter-molecular CT in the whole polymer matrix. 7 Some general strategies in CPI design include (a) introducing –F, –Cl or –CF 3 substituents with strong electro-negativity; 8–10 (b) incorporating alicyclic monomers to reduce the conjugated aromatic content; 11–16 and (c) introducing substituents with bulky or twisted structures. 17–20 Strategies (a) and (b) suppress the CT effect of PI through electronic state modification, i.e.…”

Section: Introductionmentioning

confidence: 99%

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Torsion effect of the imide ring on the performance of transparent polyimide films with methyl-substituted phenylenediamine

et al. 2022

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Ultra‐light fluorinated polyimide foams with excellent thermal insulation, low dielectric loss and high heat resistance

Jia,

Sun,

Zang

et al. 2024

J of Applied Polymer Sci

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High efficiency thermal insulation materials are highly desirable in aerospace industry, whereas combining low density and low thermal conductivity of thermal insulation materials still remains a challenge. In this work, a series of fluorinated polyimide foams (PIFs) based on 4,4‐(hexafluoroisopropylidene) diphthalic anhydride (6FDA) were successfully prepared by microwave‐assisted powder foaming. The modification of fluorination decreased the melt strength while simultaneously enhanced the thermal properties of fluorinated PIFs through the high bonding energy of CF bond. Thus, fluorinated PIFs exhibited one of the lowest densities of reported PIFs, among them, the density of PIF6FDA‐DMBZ was as low as 9.34 kg m−3. The glass transition temperature of all fluorinated PIFs was greater than 295°C. Microwave‐assisted foaming optimized the cell structure effectively, resulting in the thermal conductivity of PIF6FDA‐ODA as low as 0.029 W m−1 K−1. The incorporation of hexafluoroisopropylidene groups reduced the polarization and enhanced the free volume of fluorinated PIFs, leading to hydrophobic characteristics (CA >105°) and ultra‐low dielectric loss properties (tan δ <0.001 at 20 GHz). PIF6FDA‐ODA demonstrated the most excellent comprehensive performance. The excellent comprehensive performance of fluorinated PIFs indicated their potential application as thermal insulation and wave‐transparent materials in aerospace, railway, and shipbuilding industries.

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Fluorine Substitution Effect on the Material Properties in Transparent Aromatic Polyimides

Cited by 35 publications

References 39 publications

Synthesis and properties of transparent poly(ester‐amide‐imide)s from tert‐butylhydroquinone bis(trimellitate anhydride) and p‐phthaloyl chloride

Synthesis and properties of transparent poly(ester‐amide‐imide)s from tert‐butylhydroquinone bis(trimellitate anhydride) and p‐phthaloyl chloride

Torsion effect of the imide ring on the performance of transparent polyimide films with methyl-substituted phenylenediamine

Ultra‐light fluorinated polyimide foams with excellent thermal insulation, low dielectric loss and high heat resistance

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