1994
DOI: 10.1163/156856194x00988
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Fluoropolymer surface modification for enhanced evaporated metal adhesion

Abstract: Adhesion of evaporated Cu to Teflon PFA (polytetrafluoroethylene-co-perfluoroalkoxy vinyl ether) was greatly enhanced by plasma pretreatment. The efficiency of the treatment decreased in the following order: N2 > O2 > (N2 + H2) > (O2 + H2) > H2. X-ray photoelectron spectroscopy (XPS) showed the loss of fluorine and the incorporation of oxygen and nitrogen at the polymer surface. Among the gases, H2 was found to be the most efficient for fluorine elimination, and (N2 + H2) for surface functionalization. Based o… Show more

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Cited by 78 publications
(44 citation statements)
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“…Previously, the fluoride ion peak at a binding energy of 684 eV in the XPS spectrum was detected when evaporated Cu was thermally annealed for 30 min at 150 C on Teflon AF1600 [29] and when octofluorocyclobutane was plasma polymerized on a Cu substrate. [30] In contrast to evaporated Cu, which can be peeled easily and totally removed from untreated PFA, [9] , FEP [A. R. Guntuka and A. Entenberg, unpublished research] and PTFE, [3,7] the fluoropolymers modified to contain fluoride ions at the interface showed enhanced adhesion to thermally evaporated Cu as reported in Table 4. In addition to these chemical effects, changes in surface roughness during argon etching will also contribute to the better adhesion.…”
Section: Discussionmentioning
confidence: 99%
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“…Previously, the fluoride ion peak at a binding energy of 684 eV in the XPS spectrum was detected when evaporated Cu was thermally annealed for 30 min at 150 C on Teflon AF1600 [29] and when octofluorocyclobutane was plasma polymerized on a Cu substrate. [30] In contrast to evaporated Cu, which can be peeled easily and totally removed from untreated PFA, [9] , FEP [A. R. Guntuka and A. Entenberg, unpublished research] and PTFE, [3,7] the fluoropolymers modified to contain fluoride ions at the interface showed enhanced adhesion to thermally evaporated Cu as reported in Table 4. In addition to these chemical effects, changes in surface roughness during argon etching will also contribute to the better adhesion.…”
Section: Discussionmentioning
confidence: 99%
“…[1,2] However, the low surface energy property of fluoropolymers results in poor practical adhesion of evaporated Cu to PTFE, [3][4][5][6][7] FEP [5,6,8] and PFA. [5,6,8,9] Quantitative measurements of the adhesion strengths show stronger adhesion of evaporated copper to FEP and PFA than to PTFE, which is attributed to the larger group electronegativities of CF 3 in FEP and C 3 F 7 O in PFA than to F in PTFE. [5,6] The absence of significant reaction of evaporated Cu with the fluoropolymers to form fluoride ions with PTFE, [4,7,10] FEP [10] and PFA [9,10] is in good agreement with the observed poor adhesion.…”
Section: Introductionmentioning
confidence: 99%
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“…The plasma modification of polymers is very often used in surface cleaning or etching [52], changes in surface wettability and adhesion [53], reducing friction [54], or regulation of the cell adhesion in cytocompatibility studies [55]. The creation of the polar groups on the modified surface reaction by the reaction of activated polymer surface with gas atmosphere leads to the augmentation of adhesion, increasing hydrophilicity, or modifying the surface morphology (Fig.…”
Section: Plasma-treated Polymermentioning
confidence: 99%
“…For this, different treatments were used: chemical etching [20], high energy ion radiation [21], X-ray and electron irradiation [22], and plasma etching [23][24][25], the last being considered to be one of the most efficient techniques for surface activation of polymers [26]. It is well known that plasma environments contain neutral species, energetic ions, electrons, and photons.…”
Section: Introductionmentioning
confidence: 99%