Flux effect on void quantity and size in soldered joints

Busek, David; Dusek, Karel; Ruzicka, D.; Placek, Martin; Mach, Pavel; Urbanek, Jan; Starý, J.

doi:10.1016/j.microrel.2016.03.009

Cited by 64 publications

(31 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…), components (geometry, shape, terminal oxidation, etc.) and the process (thickness, the shape and the parameters of the solder paste's printed layer, temperature profile) [22][23][24][25][26]. An example of macrovoids in the solder joints of a soldered BGA package on the PCB is given in Figure 18.…”

Section: Macrovoidsmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

View full text Add to dashboard Cite

The formation of defects and imperfections in the soldering process can have many causes, which primarily include a poorly setup technological process, inappropriate or inappropriately used materials and their combinations, the effect of the surroundings and design errors. This chapter lists some examples of errors that can occur in soldering, while review is devoted to selected defects: non-wettability of the solder pads, dewetting, wrong solder mask design, warpage, head-in-pillow, cracks in the joints, pad cratering, black pad, solder beading, tombstoning, dendrites, voids, flux spattering from the solder paste, popcorning and whiskers.

show abstract

Section: Macrovoidsmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

View full text Add to dashboard Cite

show abstract

“…The results show that increasing the grain size reduces the tendency to form voids at the interface. Bušek et al 16 studied the large and micro-holes in the solder joints and the negative impact of the use of additional flux on the reliability of the solder joints. The results show that the void ratio can be significantly reduced by using an appropriate amount of appropriate flux in the solder paste, especially the flux with higher activity.…”

Section: Introductionmentioning

confidence: 99%

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Zhai

Zou

et al. 2021

Journal of Elec Materi

View full text Add to dashboard Cite

This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a hightemperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.

show abstract

“…Marks et al(2011) observed that the changing of the flux selection during the paste manufacture leads to a decrease of the paste recovery by about five per cent, which results in an increase of the slumping behavior (Marks et al, 2011). Recently, Bušek et al (2016) showed that the use of increased amount of proper flux (with higher activity) in the solder paste minimizes the void occurrence, increasing the performance of the reflow soldering process (Bušek et al, 2016), whereas Tu et al (2016) verified that the viscosity of the solder paste is determined by the flux (Tu et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Rheology of F620 solder paste and flux

Barbosa

Teixeira

et al. 2019

SSMT

View full text Add to dashboard Cite

Purpose The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that allow the simulation of the printing process of printed circuit boards (PCB). Design/methodology/approach Rheological tests were performed using the Malvern rheometer Bohlin CVO. These experiments consist of the analysis of the viscosity, yield stress, thixotropy, elastic and viscous properties through oscillatory tests and the capacity to recover using a creep-recovery experiment. The results obtained from this rheological analysis are compared with the rheological properties of the solder paste F620. Findings The results have shown that the flux is viscoelastic in nature and shear thinning. The viscosity does not decrease with increasing solicitations, except in the case where the flow is withdrawn directly from the bottle. Even if the solder paste shows a thixotropic behavior, this is not the case of the flux, meaning that this property is given by the metal particles. Furthermore, the oscillatory tests proved that the flux presents a dominant solid-like behavior, higher than the solder paste, meaning that the cohesive/tacky behavior of the solder paste is given by the flux. Research limitations/implications To complement this work, printing tests are required. Originality/value This work demonstrates the importance of the rheological characterization of the flux in order to understand its influence in the solder paste performance during the stencil printing process.

show abstract

Flux effect on void quantity and size in soldered joints

Cited by 64 publications

References 7 publications

Overview of Selected Issues Related to Soldering

Overview of Selected Issues Related to Soldering

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Rheology of F620 solder paste and flux

Contact Info

Product

Resources

About