Focused ion beam induced deposition of low-resistivity copper material

Gannon, Thomas J.; Gu, George; Casey, J. A.; Huynh, Chuong; Bassom, Neil; Antoniou, Nicholas

doi:10.1116/1.1826065

Cited by 16 publications

(10 citation statements)

References 6 publications

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“…In Figure 1, various applications of FEBID and FIBID are sketched: the growth of in-plane and three-dimensional nanostructures on flat substrates [25], as well as on unconventional substrates such as cantilevers/tips [26], and flexible [27], insulating [28] or origami substrates [28], etc. Materials grown by FEBID/FIBID are currently used for circuit edit and mask repair in the semiconductor industry [24,[29][30][31], lamellae preparation [7], the placement of electrical contacts to micro-and nano-structures [32,33], for producing sensors [34,35] and magnetic tips [36][37][38], plasmonic [39][40][41][42] and nano-optical elements [43], superconducting films [44] and nanowires [45], etc. Although FEBID/FIBID is an active field of research and development, a wider impact is hampered by the limited process speed.…”

Section: Focused Electron/ion Beam-induced Deposition Techniquesmentioning

confidence: 99%

Comparison between Focused Electron/Ion Beam-Induced Deposition at Room Temperature and under Cryogenic Conditions

2019

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In this contribution, we compare the performance of Focused Electron Beam-induced Deposition (FEBID) and Focused Ion Beam-induced Deposition (FIBID) at room temperature and under cryogenic conditions (the prefix "Cryo" is used here for cryogenic). Under cryogenic conditions, the precursor material condensates on the substrate, forming a layer that is several nm thick. Its subsequent exposure to a focused electron or ion beam and posterior heating to 50 • C reveals the deposit. Due to the extremely low charge dose required, Cryo-FEBID and Cryo-FIBID are found to excel in terms of growth rate, which is typically a few hundred/thousand times higher than room-temperature deposition. Cryo-FIBID using the W(CO) 6 precursor has demonstrated the growth of metallic deposits, with resistivity not far from the corresponding deposits grown at room temperature. This paves the way for its application in circuit edit and the fast and direct growth of micro/nano-electrical contacts with decreased ion damage. The last part of the contribution is dedicated to the comparison of these techniques with other charge-based lithography techniques in terms of the charge dose required and process complexity. The comparison indicates that Cryo-FIBID is very competitive and shows great potential for future lithography developments.

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Section: Focused Electron/ion Beam-induced Deposition Techniquesmentioning

confidence: 99%

Comparison between Focused Electron/Ion Beam-Induced Deposition at Room Temperature and under Cryogenic Conditions

2019

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“…For instance, deposition of Cu from copper(I)-hexafluoroacetylacetonato-trimethylvinylsilane (Cu(hfac)TMVS) as precursor has been studied and Cu contents of ~60 at.% were found 72 . Deposition of platinum has been investigated and films containing up to 46 at.% of Pt were obtained from the precursor (methylcyclopentadienyl) trimethyl platinum 67,73 .…”

Section: Metal Structuresmentioning

confidence: 99%

Comparison of fabrication methods of sub-100nm nano-optical structures and devices

et al. 2005

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Nano-optical devices are raising more and more interest for a variety of applications. From single molecule detection at high molecular concentration by Fluorescence Correlation Spectroscopy (FCS) through optical multiplexing with photonic crystal structures into the exciting field of negative index of refraction materials, the hardware functional dimensions and surely the tolerances are reaching the lower tens of nanometer range. The fabrication of such devices, i.e. the machining of optically interesting materials and material combinations (dielectric, semiconducting, or metallic) at this scale needs adaptation of classical nanostructuring technologies like Electron Beam Lithography (EBL), or the application of serial direct machining technologies like Focused Charged Particle Beam Etching or Deposition with electrons or Ga ions. For low excitation volume FCS measurements, EBL is used for production of high quality nanoscale sub-wavelength apertures in optically opaque (150 nm thick) metal films. The process consists in high aspect ratio patterning of a thick negative e-beam resist film followed by metal lift off. The optically transparent substrate allows the production of any 2D aperture geometry. Difficulties of the production process and their limits are presented. Direct serial machining with charged particle beams shows excellent flexibility and is an interesting 3D alternative method. Deposition by decomposing volatile chemicals under an ion/electron probe, which can be as small as 7nm/1nm, this technique allows for rapid, local prototyping of 2D and 3D nano-structures with highest lateral and axial resolution. The deposited material can be tuned to homogeneous, nanocomposite or crystalline, metallic or transparent, opening the way to applications in photonic crystals and plasmonics. An original in-situ micro-reflectometry method permits the real time control of the growth of the deposits.

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“…Metal lines can be lithographically patterned by parallel methods such as photolithography and nanoimprint lithography for mass production or by sequential patterning with electron beam lithography and focused ion beam [5] for mask fabrication and prototyping. All these methods require expensive equipment and facilities that are not always readily available in every research lab.…”

Section: Introductionmentioning

confidence: 99%

Selective electroplating of copper lines on pre-patterned tantalum oxide thin films

El‐Sayed

Greiner

Kruse

2007

Applied Surface Science

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Focused ion beam induced deposition of low-resistivity copper material

Cited by 16 publications

References 6 publications

Comparison between Focused Electron/Ion Beam-Induced Deposition at Room Temperature and under Cryogenic Conditions

Comparison between Focused Electron/Ion Beam-Induced Deposition at Room Temperature and under Cryogenic Conditions

Comparison of fabrication methods of sub-100nm nano-optical structures and devices

Selective electroplating of copper lines on pre-patterned tantalum oxide thin films

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