2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716)
DOI: 10.1109/icmel.2004.1314862
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Focused ion beam lithography-overview and new approaches

Abstract: Al~snncl -Focused Ion Beam (FIB) lithography has significant advantages over the electron beam counterpart in terms of resist sensitivity, backscattering and proximity effects. Applying the Top Surface Imaging (TSI) principal to FIB lithography could further enhance its capability. In this paper we review different FIB lithography processes which utilise both wet and dry development. As of further development of this technology, we report a novel lithography process which combines focused Cia' ion beam (Cia' F… Show more

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Cited by 18 publications
(20 citation statements)
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“…Gallium (Ga + ) ions are typically used in FIB, 172 and can be used to pattern a resist, similar to that of EBL, which can then be used as a mask for the deposition or etching of metal. However, FIB can also be used as a direct (i.e., maskless) physical patterning tool, through milling or FIB-induced deposition.…”
Section: Preparation Of Silver Nanostructuresmentioning
confidence: 99%
“…Gallium (Ga + ) ions are typically used in FIB, 172 and can be used to pattern a resist, similar to that of EBL, which can then be used as a mask for the deposition or etching of metal. However, FIB can also be used as a direct (i.e., maskless) physical patterning tool, through milling or FIB-induced deposition.…”
Section: Preparation Of Silver Nanostructuresmentioning
confidence: 99%
“…Reduction of the feature size is beneficial as it often results in the reduction of the amount of analyte or reagent required, permits an increased density of sensor and chip elements, and faster reaction or response times [11;12]. At the micrometer level, protein patterning has been achieved by the application of techniques such as photolithography [13;14] and microcontact printing [15;16]. These approaches prepare surfaces such that discrete regions of reactive terminal groups (e.g., self-assembled monolayers (SAMs)), organic thin films, or polymers, are created for subsequent protein adsorption [17].…”
Section: Introductionmentioning
confidence: 99%
“…Helium ion beams [25,26] as well as neon ion beams [28] have recently been investigated. Another way to effectively increase resist thickness while using heavier ions is to move away from traditional resist exposure and take advantage of ion implantation effects that can produce a negative resist pattern if developed by reactive ion etching [61][62][63]. This is a type of direct "hard mask" patterning technique that we discuss next.…”
Section: Lithography On Resistsmentioning
confidence: 99%