FoilMet^®‐Interconnect: Busbarless, electrically conductive adhesive‐free, and solder‐free aluminum interconnection for modules with shingled solar cells

Abstract

The investigation of novel cell-to-cell interconnection methods has gained importance with the increase of wafer sizes. Shingling (i.e., overlapping) of solar cells is not only a solution for the interconnection of smaller solar cells but also a chance to increase the output power density by (i) increasing the active cell area within the module, (ii) decreasing shading losses, and (iii) reducing electrical interconnection

Scaled Deposition of Ti3C2Tx MXene on Complex Surfaces: Application Assessment as Rear Electrodes for Silicon Heterojunction Solar Cells

“…g ., electroplated copper (Cu) and aluminum (Al). 8 − 10 However, the large-scale deployment of these alternative electrodes encounters several roadblocks, including low throughput and yield, cost/processing complexity, and potentially large volumes of metal-contaminated waste. 11 Hence, it is vital to seek highly conductive and less costly nonclassical metallic electrodes with high abundance, easy processability, and low toxicity.…”

“…To date, the c-Si solar cell industry has exerted several efforts to minimize Ag usage, at either the front or rear sides, by utilizing different printing patterns, stringing schemes, or device shingling or through implementing alternative metallization materials, e . g ., electroplated copper (Cu) and aluminum (Al). − However, the large-scale deployment of these alternative electrodes encounters several roadblocks, including low throughput and yield, cost/processing complexity, and potentially large volumes of metal-contaminated waste . Hence, it is vital to seek highly conductive and less costly nonclassical metallic electrodes with high abundance, easy processability, and low toxicity.…”