2015
DOI: 10.11648/j.ajee.20150303.12
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Forced Convection Heat Transfer Analysis through Dimpled Surfaces with Different Arrangements

Abstract: Dimples play a very important role in heat transfer enhancement of electronic cooling systems, heat exchangers etc. This work mainly deals with the experimental investigation of forced convection heat transfer over circular shaped dimples of different diameters on a flat copper plate under external laminar flow conditions. Experimental measurements on heat transfer characteristics of air (with various inlet flow rates) on a flat plate with dimples were conducted. From the obtained results, it was observed that… Show more

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Cited by 10 publications
(2 citation statements)
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“…It can also be seen that the variation in the Nusselt number is almost gradual with orientation as expected [12,13]. It can be seen that as expected the Nusselt number, heat transfer coefficient 'h' and heat transfer rate 'Q' follows the same trend as for the copper plate [16] but with a little lower value because of the low thermal conductivity of aluminum plates as compared to copper plate. It is obvious that 'h' increases as compared to flat plates because the dimple arrangement causes delay in the development of the thermal boundary layer & hence increases the local heat transfer in the reattachment region and increases the heat transfer coefficient [1].It can also be seen that 'Q' increases with decrease in orientation angle of dimples.…”
Section: Resultssupporting
confidence: 77%
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“…It can also be seen that the variation in the Nusselt number is almost gradual with orientation as expected [12,13]. It can be seen that as expected the Nusselt number, heat transfer coefficient 'h' and heat transfer rate 'Q' follows the same trend as for the copper plate [16] but with a little lower value because of the low thermal conductivity of aluminum plates as compared to copper plate. It is obvious that 'h' increases as compared to flat plates because the dimple arrangement causes delay in the development of the thermal boundary layer & hence increases the local heat transfer in the reattachment region and increases the heat transfer coefficient [1].It can also be seen that 'Q' increases with decrease in orientation angle of dimples.…”
Section: Resultssupporting
confidence: 77%
“…It can be seen that as expected the Nusselt number, and heat transfer coefficient 'h' curve for aluminum plate follows the same trend as for the copper plate [16] but with a little lower value because of the low thermal conductivity of aluminum plates. Nusselt number 'Nu' and heat transfer coefficient 'h' are higher for low angle orientation of dimples because at low angles the dimples are close to each other hence a pronounce effect of dimples is felt which is obvious from the figure.…”
Section: Resultssupporting
confidence: 72%