Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

Nishikawa, Hiroshi; Iwata, Noriya

doi:10.1016/j.jmatprotec.2014.08.007

Cited by 78 publications

(19 citation statements)

References 14 publications

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“…From the figure, it is confirmed that the growth of interfacial IMC layers follows diffusion control mechanism. In addition, other researchers [14,15] noticed that the interfacial IMC layers in many solder systems follow the diffusion control mechanism.…”

Section: Resultsmentioning

confidence: 99%

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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Abstract-To simulate the application environment of a number of electronic products, the growth of Sn-0.3Ag-0.7Cu-0.5Bi-Ni/Cu solder joints with low content of Ag was investigated during aging in an interval mode. It shows that the intermetallic compound (IMC) (Cu,Ni) 6 Sn 5 layer becomes thicker with increasing aging time. The growth of IMC (Cu,Ni) 6 Sn 5 layer during aging follows the diffusion control mechanism. Furthermore, it is demonstrated that there is no IMC Cu3Sn layer appear whatever increasing the aging time. It is explained the phenomenon is mainly attribute to the interval aging mode. According to kinetics, the activation energy is not high enough to overcome the energy obstacle due to the interval aging mode and finally the Cu3Sn phase doesn't form. Hence, the reliability of solder joints is improved.

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Section: Resultsmentioning

confidence: 99%

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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“…Hal ini adalah kerana pertumbuhan IMC secara berlebihan akan menyebabkan kerapuhan antarasambungan pateri yang seterusnya akan mengakibatkan kegagalan sambungan pateri. Kebolehharapan sambungan pateri yang mengurang dalam jangka masa panjang merupakan indikasi penting bahawa alat peranti mudah alih akan rosak (Nishikawa & Iwata 2015). Maka daripada itu, kebanyakan pengkaji akan memberi fokus terhadap IMC (Zhang & Zhang 2011) untuk memahami dan mengubah suai lapisan IMC bagi meningkatkan kebolehharapan sambungan pateri (Fallahi et al 2012).…”

Section: Pengenalanunclassified

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Bakar

Jalar²,

Abdullah

et al. 2018

JSM

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ABSTRAKBahan aloi pateri dalam kumpulan Sn-Ag-Cu (SAC) merupakan bahan pematerian yang bebas plumbum digunakan secara meluas dalam industri elektronik. Antarasambungan pateri bertindak untuk menghubungkan komponen elektronik pada papan litar bercetak (PCB). PCB memainkan peranan yang penting dalam tindak balas pematerian dan mikrostruktur antarasambungan pateri-substrat seterusnya mempengaruhi kebolehharapan suatu sambungan pateri. Pes pateri Sn0.3Ag0.7Cu (SAC0307) dipaterikan pada tiga jenis PCB iaitu PCB tanpa salutan (PCB/Cu) sebagai sampel kawalan, PCB dengan salutan timah (PCB/Sn) dan PCB dengan salutan nikel (PCB/Ni). Kajian ini bertujuan untuk mengkaji kesan salutan permukaan PCB ke atas pertumbuhan sebatian antara logam (IMC) selepas uji kaji penuaan sesuhu yang berbeza selama 1000 jam. Keputusan menunjukkan purata ketebalan lapisan IMC ~ 5.7 μm serta kadar pertumbuhan lapisan IMC yang paling rendah adalah selari dengan tenaga pengaktifan tertinggi dengan salutan Ni iaitu 41 kJ/mol berbanding PCB/Cu dan PCB/Sn. Ini bermakna salutan Ni pada PCB mampu mengawal pertumbuhan IMC sehingga lebih kurang 40% berbanding salutan Sn dan tanpa salutan.Kata kunci: Antarasambungan pateri; salutan Ni; sebatian antara logam; Sn-Ag-Cu; tenaga pengaktifan ABSTRACT Solder alloy materials in Sn-Ag-Cu (SAC) group is a lead free soldering materials which widely used in the electronics industry. Solder interconnection act to attach electronic components to printed circuit boards (PCBs). PCB plays an important role in soldering reactions and microstructure solder interconnection-substrate which further affects the reliability of a solder joint. Solder paste of Sn0.3Ag0.7Cu (SAC0307) is soldered on three types of PCB ie PCB without coating (PCB/Cu) as controlled sample, PCB with tin coating (PCB/Sn) and PCB with nickel coating (PCB/Ni). The purpose of this study was to investigate the effect of PCB surface coating on the growth of intermetallic compound (IMC) after different aging tests for 1000 h. The results showed that the average IMC layer thickness ~ 5.7 μm together with lowest IMC layer growth rate is in line with highest activation energy, 41 kJ/mol with the usage of Ni coating as compared to PCB/Cu and PCB/Sn. This means that the Ni coating on PCB is able to control IMC growth up to 40% compared to Sn coating and non-coating.

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“…Teknik metalografi bermula dengan pemotongan sampel, proses cagak, proses lelasan dan proses penggilapan bagi mendapatkan permukaan sampel yang bebas calar (Bakar et al 2016 Dalam kajian ini, sekurang-kurangnya 300 bacaan nilai ketebalan telah diambil kerana faktor ralat statistik diminimumkan bagi perwakilan nilai seperti dalam Rajah 2. Jika melihat hasil kajian lepas dalam mendapatkan purata ketebalan, pengukuran bacaan yang diambil adalah sekitar 9-30 bacaan (Alam & Chan 2005;Hang et al 2008;Kammerer et al 2015;Nishikawa & Iwata 2015;Yoon et al 2005;Zhao et al 2006). Di sini timbul persoalan, adakah jumlah titik bacaan yang diambil mencukupi dan boleh menggambarkan ketebalan lapisan IMC sedangkan lapisan IMC yang tumbuh jelas tidak sekata.…”

Section: Bahan Dan Kaedahunclassified

Penilaian Semula Pengukuran Kuantitatif Stereometri terhadap Pertumbuhan Sebatian antara Logam bagi Sambungan Pateri

Bakar¹,

Jalar²,

Ismail³

2018

JSM

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Reassessment of Stereometric Quantitative Measurements on the Growth of Intermetallic Compound for Solder Connections) Maria abu bakar, azMan Jalar* & roslina isMail abstrak Pencerapan dua dimensi (2D) yang diperoleh daripada keratan rentas sampel selalunya digunakan untuk mendapatkan maklumat ketebalan lapisan sebatian antara logam (IMC). Walau bagaimanapun, pencerapan 2D amatlah terhad berbanding maklumat yang sepatutnya diperoleh daripada struktur tiga dimensi (3D) sampel. Kajian ini bertujuan untuk menilai semula kaedah pengukuran lapisan IMC daripada pemerhatian 2D dengan mempertimbangkan faktor-faktor sebenar dalam bentuk 3D IMC. Nilai mod ketebalan didapati lebih mewakili nilai ketebalan IMC setelah mempertimbangkan pelbagai faktor stereometri berbanding dengan nilai purata. Ini memberikan suatu penanda aras dalam aktiviti menentukan ketebalan lapisan IMC berdasarkan pencerapan 2D daripada struktur 3D.

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Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

Cited by 78 publications

References 14 publications

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Penilaian Semula Pengukuran Kuantitatif Stereometri terhadap Pertumbuhan Sebatian antara Logam bagi Sambungan Pateri

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