Formation and growth of manganese phosphate passivation layers for NTC ceramics

Hsiang, Hsing I.; Li, Mei; Lin, Yi Hon

doi:10.1016/j.jallcom.2009.05.026

Cited by 12 publications

(2 citation statements)

References 6 publications

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“…It has been commonly utilized as an additive to achieve high surface corrosion-resistance to strengthen the wear-resistant of steels. 35 In recent years, hureaulite synthetic methodologies and physicochemical properties have attracted massive attention in material and mineralogical sciences. Nevertheless, using hureaulite in electrocatalytic oxidation of formaldehyde is scarce.…”

Section: Introductionmentioning

confidence: 99%

Bimetallic nickel/manganese phosphate–carbon nanofiber electrocatalyst for the oxidation of formaldehyde in alkaline medium

et al. 2022

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Section: Introductionmentioning

confidence: 99%

Bimetallic nickel/manganese phosphate–carbon nanofiber electrocatalyst for the oxidation of formaldehyde in alkaline medium

et al. 2022

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“…A nickel film is often electroplated onto the silver conductor surface to serve as a soldering barrier to prevent silver leaching. However, metal electroplating is unsuitable for semi-conductive ceramic components because it complicates production [4]. Solder leaching can also be reduced by using a conductor paste based on a mixed metal powder of Ag and palladium (Pd) or platinum (Pt) instead of a paste made of only Ag [5].…”

Section: Introductionmentioning

confidence: 99%

Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

Hsiang

Chen

2021

SN Appl. Sci.

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This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures. Silica nanoparticles (NPs) were deposited onto a silver powder surface to inhibit silver leaching, which can lead to soldering joint failure during high-temperature soldering. The NPs were deposited through hydrolysis and a condensation reaction of tetraethyl orthosilicate (TEOS) based on the Stöber method. Fourier transform infrared spectroscopy and scanning electron microscopy were used to observe the microstructures of silver powders after the deposition of silica NPs with various TEOS concentrations and various deposition times. As the deposition time increased, the amount of silica NPs on the surface of the silver powder increased. The transmission electron microscopy results show that silica NPs were located at the IMC grain boundaries, which can hinder the dissolution of IMCs by lead-free solder melt along grain boundaries during soldering, retarding silver leaching. The growth kinetics and mechanism of IMCs during soldering were investigated. The results show that the growth of IMCs is mainly dominated by bulk diffusion. The activation energy for IMC growth increased and the growth rate decreased with increasing silica NP addition and deposition time.

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An enhanced performance of hybrid supercapacitor based on polyaniline-manganese phosphate binary composite

Lee

Omar

Numan

et al. 2017

J Solid State Electrochem

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Formation and growth of manganese phosphate passivation layers for NTC ceramics

Cited by 12 publications

References 6 publications

Bimetallic nickel/manganese phosphate–carbon nanofiber electrocatalyst for the oxidation of formaldehyde in alkaline medium

Bimetallic nickel/manganese phosphate–carbon nanofiber electrocatalyst for the oxidation of formaldehyde in alkaline medium

Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

An enhanced performance of hybrid supercapacitor based on polyaniline-manganese phosphate binary composite

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