Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes
Dan Liu,
Liang Fang,
Zhonghao Huang
et al.
Abstract:The Cu undercut is a recently discovered new defect generated in the wet stripping process of MoNb/Cu gate stacked electrodes for thin-film transistors (TFTs). The formation mechanism and preventive strategy of this defect were identified and investigated in this paper. The impact of stripper concentration and stripping times on the morphology and the corrosion potential (Ecorr) of Cu and MoNb were studied. It is observed that the undercut is Cu tip-deficient, not the theoretical MoNb indentation, and the unde… Show more
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