Synchrotron topographic and optical microscopic studies are presented of stacking faults formed during homo-epitaxy of 4H-SiC. Grazing incidence synchrotron white beam x-ray topographs reveal V and Y shaped features which transmission topographs reveal to be ¼[0001] Frank-type stacking faults. Geometric analysis of the size and shape of these faults indicates that they are fully contained within the epilayer and appear to be nucleated at the substrate/epilayer interface. Detailed analysis shows that the positions of the V shape stacking faults match with the positions of c-axis threading dislocations with Burgers vectors of c or c+a in the substrate and thus appear to result from the deflection of these dislocations during epilayer growth. Similarly, the Y shaped defects match well with the substrate surface intersections of c-axis threading dislocations with Burgers vectors of c or c+a in the substrate which were deflected onto the basal plane during substrate growth. A model for their formation mechanism is presented. IntroductionIt is generally acknowledged that defects within the active regions of 4H-SiC devices can have a deleterious effect on their performance. Since most of the defects in homoepitaxial layers are inherited from the substrate, much effort has recently been expended on minimizing the substrate defect densities. However, for the finite density of defects that currently remains in the substrate, a key issue is understanding how they propagate into the epilayer since this can present an opportunity to engineer the defect configuration in the epilayer. For example, if basal plane dislocations (BPDs) are allowed to propagate into the epilayer and result in the formation of Shockley stacking faults they are known to cause forward voltage drop in pin devices [1]. Consequently, much effort has been devoted to ensuring that basal plane dislocations are converted to relatively benign threading edge dislocations (TEDs) at the substrate-epilayer interface. This is achieved through modification of surface morphology (etching) [2] or by the use of epilayer growth interruptions [3]. Generally speaking, all defects piercing the substrate growth surface must propagate into the epilayer either in their original form or alternatively be deflected into a different direction of propagation. In all cases, the displacement vectors associated with the defects must be conserved across the interface. In this paper we present observations of epilayer defects predominantly observed close to the edges of an n-buffer plus n-type drift structure. These defects appear to be faint needle-like linear surface morphological features. Synchrotron white beam topography images show that 10.1149/06407.0125ecst ©The Electrochemical Society ECS Transactions, 64 (7) 125-131 (2014) 125 ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.200 Downloaded on 2015-04-10 to IP