Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions

Yang, Ting; Liu, Yu Chen; Yang, Chih han; Kuo, Yi kai; Lin, Shih‐kang

doi:10.1007/s11837-020-04302-5

Cited by 7 publications

(2 citation statements)

References 33 publications

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“…Kirkendall voids have been found to propagate mainly inside the Cu 3 Sn phase layer or at the Cu 3 Sn/Cu interface where imbalanced diffusion might occur. 11,[31][32][33][34] As a result, suppression of the Cu 3 Sn growth by minor alloying (Pd, Ge, Ga, Co-Ni) of solders 11,[31][32][33] or minor Ni addition to Cu 34 became an effective strategy to suppress the Kirkendall voids. In our study, the difference of the growth rates of Cu 3 Sn among various systems (Fig.…”

Section: Resultsmentioning

confidence: 99%

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Chiang

Shen

Feng

et al. 2020

J. Electrochem. Soc.

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Electrodeposition of Cu receives considerable attention due to its wide application in microelectronic products. Sn-rich alloys are commonly used to join the electroplated Cu to form solder joints, while their interactions give rise to undesired Kirkendall voids. Suppression of voids is imperative to ensure reliable solder joints with mechanical robustness. In this study, twinned Cu with various crystal orientations are constructed using electroplating and their efficacy on void suppression are investigated. Four Cu electroplated films (Cu A, B, C, and D) with numerous twin boundaries and different (111) and (110) ratios are joined with Sn-rich solder (SAC305) and thermally aged at 200 °C. The voiding propensity is in an order of Cu D > Cu C > Cu B > Cu A, inversely corresponding to their (111) ratios (Cu A > Cu B > Cu C > Cu D). Particularly, a void-free solder joint constructed by the electroplated Cu A film with plenty of twinned bamboo structures is observed. The findings demonstrate that Σ3 twin boundary in the bamboo structure with 〈111〉-preferred orientation has much higher efficiency at suppressing the Kirkendall effect than that in 〈110〉-preferred Cu films.

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Section: Resultsmentioning

confidence: 99%

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Chiang

Shen

Feng

et al. 2020

J. Electrochem. Soc.

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“…[1][2][3] Numerous studies have been conducted on the growth of the IMC layer subjected to reliability testing in terms of its formation, growth behaviour, size, shape, and relationship with the mechanical reliability and lifespan of electronic devices. [4][5][6][7][8][9][10] For instance, a recent study by Zarmai et al 11 highlighted the relationship between the IMC layer thickness and the thermomechanical reliability of solder joints. Higher IMC layer thickness has decreased the solder joint fatigue life.…”

Section: Introductionmentioning

confidence: 99%

Linear growth behaviour of intermetallic compound layer in electronic interconnections

Bakar,

Jalar,

Alias

2024

Science and Technology of Welding and Joining

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We observed a linear behaviour of intermetallic compound (IMC) layer growth in electronic metallurgical interconnections, although the time required was twice that of commercial reliability standards for electronic packaging. This finding contradicts the classical parabolic growth law, which is widely reported to represent growth behaviour. We suggest that the parabolic growth law may be inadequate to thoroughly explain the IMC layer's growth by considering (a) one-directional growth and (b) reactions between elements for formation and growth. Further analysis has been carried out to analyse the logical judgment of the parabolic growth law and support our finding over linear IMC layer growth behavior.

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Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints

Li,

Xu,

Chen

et al. 2024

J Mater Sci: Mater Electron

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Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions

Cited by 7 publications

References 33 publications

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Linear growth behaviour of intermetallic compound layer in electronic interconnections

Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints

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