Journal of Materials Research and Technology
 2024
DOI: 10.1016/j.jmrt.2023.12.113
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Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding

Wan-Geun Lee,
Kwang-Seong Choi,
Yong-Sung Eom
et al.
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