2011
DOI: 10.12693/aphyspola.120.105
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Formation of Cone-Shaped Inclusions and Line Defects on the Cz-Si Wafer Surface by the Helium Implantation and DC Nitrogen Plasma Treatment

Abstract: The general goal of this work is to investigate the defects formed on the surface of the Cz-Si wafers subjected to helium implantation, vacuum annealing and nitrogen plasma treatment. The performed scanning electron microscopy study has shown that in the general case two types of surface defects can be formed: cone-shaped inclusions with the base diameter of 0.2-2 µm and the ratio of diameter to height of approximately 1:1, as well as crystallographically oriented line defects with the length equal to 0.2-2 µm… Show more

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“…[1] the possibility to form an array of cone--shaped defects on the silicon wafer surface after the hydrogen plasma treatment was demonstrated. However, the nature and formation mechanism for these defects are still ambiguous.…”
Section: Introductionmentioning
confidence: 99%
“…[1] the possibility to form an array of cone--shaped defects on the silicon wafer surface after the hydrogen plasma treatment was demonstrated. However, the nature and formation mechanism for these defects are still ambiguous.…”
Section: Introductionmentioning
confidence: 99%