Formation of continuous platinum layer on top of an organic monolayer by electrochemical deposition followed by electroless deposition

Qu, Deyu; Uosaki, Kohei

doi:10.1016/j.jelechem.2011.03.020

Cited by 12 publications

(13 citation statements)

References 59 publications

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“…The reason for the different behavior is not clear, but it probably combines the more open nature of the cyanide SAM (θ CN = 0.5), which probably favors penetration, with a lower barrier for the diffusion of the cations over the adlayer, which would be sensitive to the chemical nature of the cation. [26,32,40]. As noted by Silien et al…”

Section: Metalli Metalli Metallimentioning

confidence: 73%

Electrochemical metallization of molecular adlayers

Mwanda

Cuesta

2019

Current Opinion in Electrochemistry

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Electrochemical metallization of molecular adlayers allows to sandwich a group of molecules between a metallic substrate and a metal nanoisland or nanocluster through a wet process not requiring expensive vacuum equipment and with precise control through the electrode potential. This metal-molecule-metal sandwiches could provide a simple means to integrate molecules in electronic circuits, or to explore effects arising due to quantum confinement of electrons due to the reduced dimensions of the islands or clusters deposited on the adlayer. Although initial attempts resulted in penetration through the adlayer and direct deposition on the metal substrate, the development 14 years ago of a two-step technique involving preadsorption of the target cation on the SAM prior to its reduction in an electrolyte not containing that cation opened a whole new range of possibilities. In this brief review we discuss the development and recent advances in the implementation of this technique, and briefly discuss the outlook for future work.

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Section: Metalli Metalli Metallimentioning

confidence: 73%

Electrochemical metallization of molecular adlayers

Mwanda

Cuesta

2019

Current Opinion in Electrochemistry

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“…Electrodeposition could be an attractive method for the metallization of monolayers because it does not require expensive vacuum equipment, and it is often easier to control. However, this methodology has so far been unsuccessful since the formation of clusters, or the penetration of metal ions from the solution or even metal wires through the defect sites in the monolayer are often observed-resulting in very low yield devices [84,359,360]. Although these problems-which are mainly associated with the existence of imperfections in the monolayer and the presence of free metal ions in the solution-have been able to be overcome or reduced [22,[361][362][363], still exits serious limitations in this approach.…”

Section: Fabrication Of the Top Contact Electrodementioning

confidence: 99%

Nanofabrication Techniques in Large-Area Molecular Electronic Devices

2020

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The societal impact of the electronics industry is enormous—not to mention how this industry impinges on the global economy. The foreseen limits of the current technology—technical, economic, and sustainability issues—open the door to the search for successor technologies. In this context, molecular electronics has emerged as a promising candidate that, at least in the short-term, will not likely replace our silicon-based electronics, but improve its performance through a nascent hybrid technology. Such technology will take advantage of both the small dimensions of the molecules and new functionalities resulting from the quantum effects that govern the properties at the molecular scale. An optimization of interface engineering and integration of molecules to form densely integrated individually addressable arrays of molecules are two crucial aspects in the molecular electronics field. These challenges should be met to establish the bridge between organic functional materials and hard electronics required for the incorporation of such hybrid technology in the market. In this review, the most advanced methods for fabricating large-area molecular electronic devices are presented, highlighting their advantages and limitations. Special emphasis is focused on bottom-up methodologies for the fabrication of well-ordered and tightly-packed monolayers onto the bottom electrode, followed by a description of the top-contact deposition methods so far used.

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“…These factors, especially the electrical current density in the unit surface of the cathode, determine the deposition rate. The electrical current distribution in lumps of cathodic surfaces are more than recesses, and this change in current density affects metal distribution, as the thickness of coating deposition corresponds with the current density (22)(23)(24)(25)(26)(27)(28)(29)(30)(31)(32)(33).…”

Section: General Principlesmentioning

confidence: 99%