Formation of Crystalline Si Optical Waveguides on Bulk (100) Si Substrate as a New Platform for On-Chip Interconnect Applications

Hung, S.; Lin, S.; Chao, Jiun-Jie; Chang, Chia‐Yu; Lin, Meng-Jie; Lin, Ching‐Fuh

doi:10.1109/jlt.2016.2646381

Cited by 4 publications

(2 citation statements)

References 33 publications

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“…Another way of integrating optical waveguides on bulk Si is lithographical patterning of the surface to produce c-Si fins, followed by laser processing (248 nm KrF excimer laser with a pulse duration of 25 ns and pulse energies up to 700 mJ) to reshape the top half and subsequent oxidation to produce a cladding, [112,113] as schematically shown in Figure 8b. Moreover, the laser thermal processing helps to reduce surface scattering losses after the patterning process by melting and subsequent reflowing of the c-Si waveguides due to the surface tension.…”

Section: Laser Annealing Crystallization and Reflowing Of Semiconductors On Planar Substrates For Fabrication Of Optical Waveguidesmentioning

confidence: 99%

Laser Thermal Processing of Group IV Semiconductors for Integrated Photonic Systems

Aktaş

Peacock

2021

Advanced Photonics Research

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In the quest to expand the functionality and capacity of group IV semiconductor photonic systems, new materials and production methods are constantly being explored. In particular, flexible fabrication and postprocessing approaches that are compatible with different materials and allow for tuning of the components and systems are of great interest. Within this research area, laser thermal processing has emerged as an indispensable tool that can be applied to enhance and/or modify the material, structural, electrical and optical properties of group IV elemental and compound semiconductors at various stages of the production process. Herein, the recent progress made in the application of laser processing techniques to develop integrated semiconductor systems in both fiber‐ and planar‐based platforms is evaluated. Laser processing has allowed for the production of semiconductor waveguides with high crystallinity in the core and low optical losses, as well as postfabrication trimming of device characteristics and direct writing of tunable strain and composition profiles for bandgap engineering and optical waveguiding. For each platform, the current challenges and opportunities for the future development of laser‐processed integrated semiconductor photonic systems are presented.

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Section: Laser Annealing Crystallization and Reflowing Of Semiconductors On Planar Substrates For Fabrication Of Optical Waveguidesmentioning

confidence: 99%

Laser Thermal Processing of Group IV Semiconductors for Integrated Photonic Systems

Aktaş

Peacock

2021

Advanced Photonics Research

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“…Silicon (Si) photonics field has been receiving a great attention recently for its unique properties. Regarding integrated photonic platforms, Si can be used to achieve a single-chip CMOS-compatible circuit for optical interconnect applications [1][2][3]. Electro-optical (EO) modulators [4][5][6] are basic components in Si photonic connections.…”

Section: Introductionmentioning

confidence: 99%

Silicon ring resonator electro-optical modulator utilizing epsilon-near-zero characteristics of indium tin oxide

2019

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One crucial component in optical communication systems is the optical modulator. It links between the electric and optical domains as it transforms the electric signal into an optical stream. Electro-optical modulation is a very popular scheme. Recently, indium tin oxide (ITO) has been intensively used in optical modulators due to its epsilon-near-zero characteristics. A silicon electro-optic ring resonator modulator is proposed in terms of the outspread application of ITO. An extinction ratio of about 14 dB as well as an insertion loss of 0.075 dB are achieved at a standard telecommunication wavelength of 1.55 microns. The design has low losses, high efficiency, and compact size.

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Drift-diffusion numerical simulation of UTC photodiodes for on-chip optical interconnections

Pisarenko

Ryndin

2018

J. Phys.: Conf. Ser.

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Formation of Crystalline Si Optical Waveguides on Bulk (100) Si Substrate as a New Platform for On-Chip Interconnect Applications

Cited by 4 publications

References 33 publications

Laser Thermal Processing of Group IV Semiconductors for Integrated Photonic Systems

Laser Thermal Processing of Group IV Semiconductors for Integrated Photonic Systems

Silicon ring resonator electro-optical modulator utilizing epsilon-near-zero characteristics of indium tin oxide

Drift-diffusion numerical simulation of UTC photodiodes for on-chip optical interconnections

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