Formation of Cu-based nanoparticles during imidization of PAA into PI in the various environments

Choi, Jae-Youn; Dong, Wenguo; Kim, Young‐Ho

doi:10.1016/j.colsurfa.2007.04.149

Cited by 10 publications

(9 citation statements)

References 23 publications

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“…After the post heat-treatment in an oxidizing atmosphere, the SPR peak disappeared because Cu nanoparticles were oxidized. While a blue-shifted absorption peak of Cu 2 O nanoparticles embedded in 100 nm-thick PI matrices was observed at 455 nm in previous research, 26 it is difficult to identify quantum size effect of Cu 2 O nanoparticles in a 1500 nmthick PI film because constructive peaks from the thick PI film overlap the range of blue-shifted absorption by Cu 2 O nanoparticles. In the sample which was post heat-treated at 300 C, the number of constructive peaks decreased, but, it is still difficult to identify the blue-shifted absorption peak from the metal-oxide nanoparticles.…”

Section: Optical Absorptionmentioning

confidence: 88%

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Yoon

Choi²,

Kim³

2011

j nanosci nanotechnol

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We investigated the formation of CuO or Cu2O nanoparticles in the thick polyimide films by oxidizing Cu nanoparticles at various temperatures during the post heat-treatment. Cu nanoparticles of 4-5 nm in diameter were initially formed in the polyimide film by the reaction between a Cu film and a polyimide precursor, polyamic acid, and a following thermal curing in a reducing atmosphere. After the subsequent post heat-treatments in oxidizing atmospheres, X-ray diffraction patterns revealed that initial metallic Cu nanoparticles were transformed to Cu2O or CuO nanoparticles depending on the temperature during the post heat-treatment. Cu nanoparticles were oxidized to Cu2O during the post heat-treatment at low temperature while Cu nanoparticles were oxidized to CuO during the post heat-treatment at high temperature. Cross-sectional TEM studies showed that about 4.7 nm sized Cu2O nanoparticles or 4.7-5.2 nm sized CuO nanoparticles were fabricated in a thick polyimide film depending on the post heat-treatment condition. In the optical absorption measurements, the absorption peak from surface plasmon resonance of Cu nanoparticles disappeared during the post heat-treatment in an oxidizing atmosphere.

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Section: Optical Absorptionmentioning

confidence: 88%

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Yoon

Choi²,

Kim³

2011

j nanosci nanotechnol

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“…Generation of the foam structure was caused primarily by the removal of the residual NMP solvent and the volatilization of the low molecular weight by-products at the PI/copper interface due to the imidization of the PAAs or the thermal decomposition of the metal-PAA compexes. [35] In contrast, as Fig. 7(e) showed, the peeled PI3 film surface was covered with PI fibers.…”

Section: Mechanisms Of the Improved Adhesionmentioning

confidence: 75%

Novel Poly(benzoxazole-etherimide) Copolymer for Two-Layer Flexible Copper-Clad Laminate

Zhuang

2012

Journal of Macromolecular Science, Part B

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A new random co-polyimide (co-PI), poly (benzoxazole-etherimide), was prepared via the poly(amic acid) from the reaction of 5-amino-2-(4-aminobenzene)-1,3-benzoxazole (BOA) and 4,4 -oxydianiline (ODA) with 3,3 ,4,4 -biphenyl tetracarboxylic dianhydride (BPDA) at a diamine molar ratio of 6:4. The BOA-type and ODA-type homo-PIs were also prepared for comparison. The aggregation structure and properties of the PI films were analyzed. The co-PI film showed a good balance in thermal properties, tensile strength, film toughness, and water absorption. The two-layer flexible copper-clad laminates made from these PIs were produced by coating poly(amic acid) solutions onto copper foils and then imidizing thermally. The adhesion properties and relative thermodimensional stability of the laminates were evaluated. The laminate based on the co-PI had higher relative thermodimensional stability as well as better adhesion property than those based on the two homo-PIs, which is due to the improvement in both the bonding strength of PI/copper at the interface and the cohesive strength of the co-PI itself in the boundary layer near the interface.

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“…All of them indicated obviously the cyclodehydration of amide groups and the formation of polyimide groups. 38,39 Fig. 4 is the FTIR spectra of the prepared PI TFC membranes with different chemical imidization time (1 h, 4 h, 24 h).…”

Section: Resultsmentioning

confidence: 99%

Polyimide thin film composite (TFC) membranes via interfacial polymerization on hydrolyzed polyacrylonitrile support for solvent resistant nanofiltration

Yang

Zhen

2017

RSC Adv.

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Formation of Cu-based nanoparticles during imidization of PAA into PI in the various environments

Cited by 10 publications

References 23 publications

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Novel Poly(benzoxazole-etherimide) Copolymer for Two-Layer Flexible Copper-Clad Laminate

Polyimide thin film composite (TFC) membranes via interfacial polymerization on hydrolyzed polyacrylonitrile support for solvent resistant nanofiltration

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Formation of Cu-based nanoparticles during imidization of PAA into PI in the various environments

Cited by 10 publications

References 23 publications

Fabrication of CuO and Cu2O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Fabrication of CuO and Cu2O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Novel Poly(benzoxazole-etherimide) Copolymer for Two-Layer Flexible Copper-Clad Laminate

Polyimide thin film composite (TFC) membranes via interfacial polymerization on hydrolyzed polyacrylonitrile support for solvent resistant nanofiltration

Contact Info

Product

Resources

About

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere

Fabrication of CuO and Cu₂O Nanoparticles in a Thick Polyimide Film by Post Heat Treatment in a Controlled-Atmosphere