Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

Hou, Jingxin; Li, Xiuyan; Lu, K.

doi:10.3390/nano11092252

Cited by 5 publications

(2 citation statements)

References 32 publications

(78 reference statements)

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“…Generally speaking, the sample deformation layer processed by SMGT technology is significantly deeper than that of SMAT, which can meet some industrial requirements. Stable gradient nanostructures have been successfully prepared on the surface of a series of metals such as copper and nickel by this technique ( Hou et al, 2021 ).…”

Section: Surface Nanocrystallizationmentioning

confidence: 99%

Advances in surface modification of tantalum and porous tantalum for rapid osseointegration: A thematic review

Wang

et al. 2022

Front. Bioeng. Biotechnol.

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After bone defects reach a certain size, the body can no longer repair them. Tantalum, including its porous form, has attracted increasing attention due to good bioactivity, biocompatibility, and biomechanical properties. After a metal material is implanted into the body as a medical intervention, a series of interactions occurs between the material’s surface and the microenvironment. The interaction between cells and the surface of the implant mainly depends on the surface morphology and chemical composition of the implant’s surface. In this context, appropriate modification of the surface of tantalum can guide the biological behavior of cells, promote the potential of materials, and facilitate bone integration. Substantial progress has been made in tantalum surface modification technologies, especially nano-modification technology. This paper systematically reviews the progress in research on tantalum surface modification for the first time, including physicochemical properties, biological performance, and surface modification technologies of tantalum and porous tantalum.

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Section: Surface Nanocrystallizationmentioning

confidence: 99%

Advances in surface modification of tantalum and porous tantalum for rapid osseointegration: A thematic review

Wang

et al. 2022

Front. Bioeng. Biotechnol.

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“…These factors govern the evolution of microstructure and defects, which in turn influence the material's performance [1,5,6]. Experimental results have substantiated that microhardness can escalate from an initial 0.7 GPa to 2.1 GPa under specific deformation conditions [7,8]. Moreover, copper alloyed with 0.2 wt% magnesium has shown a marked increase in microhardness, surpassing the 2.0 GPa threshold following multi-pass equal channel Metals 2023, 13, 1641 2 of 10 angular pressing.…”

Section: Introductionmentioning

confidence: 96%

An Effective Framework for Predicting Performance of Solid-Solution Copper Alloys Using a Feature Engineering Technique in Machine Learning

Fan,

Hou,

2023

Metals

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Utilized extensively in a myriad of industries, solid-solution copper alloys are prized for their superior electrical conductivity and mechanical properties. However, optimizing these often mutually exclusive properties poses a challenge, especially considering the complex interplay of alloy composition and processing techniques. To address this, we introduce a novel computational framework that employs advanced feature engineering within machine learning algorithms to accurately predict the alloy’s microhardness and electrical conductivity. Our methodology demonstrates a substantial enhancement over traditional data-driven models, achieving remarkable increases in R2 scores—from 0.939 to 0.971 for microhardness predictions and from −1.05 to 0.934 for electrical conductivity. Through machine learning, we also spotlight key determinants that significantly influence overall performance of solid-solution copper alloys, providing actionable insights for future alloy design and material optimization.

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