Future fusion experiments will rely on tungsten armour tile for their plasma facing components. In order to sustain steady state operation, the components need to be cooled through an attachment to a heat sink. All current reference concepts rely on contact bonds, unfavourable for long term application (high temperature service, cycle fatigue, thermal shocks). Three routes toward the development of thick tungsten bonds are presented here, namely functionally graded tungsten copper assembly, electron beam welding of tungsten, and coating processes. All present favourable prospects, and tend to indicate that a thick bond is possible with tungsten. Dedicated programs as well as industrial implication are however required if such concepts are to be used actually for the fabrication of large components series.