The effect of (10-25) MeV electron irradiation on Si-SiO 2 structures implanted with different ions (Ar, Si, O, B, and P) has been investigated by different methods, such as deep-level transient spectroscopy (DLTS), thermo-stimulated current (TSCM), Rutherford backscattering (RBS), and soft X-ray emission spectroscopy (SXES). It has been shown that in double-treated Si-SiO 2 structures, the defect generation by high-energy electrons depends significantly on the location of preliminary implanted ions relative to the Si-SiO 2 interface as well as on the type (n-or p-Si) of silicon wafer. SiO 2 surface roughness changes, induced by ion implantation and high-energy electron irradiation of Si-SiO 2 structures, are observed by the atomic force microscopy (AFM). Si nanoclusters in SiO 2 of ion-implanted Si-SiO 2 structures generated by MeV electron irradiation is also discussed.