2017
DOI: 10.1016/j.ceramint.2017.03.060
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Formation of sol–gel derived (Cu,Mn,Co)3O4 spinel and its electrical properties

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Cited by 24 publications
(8 citation statements)
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“…It is therefore likely that Fe 3+ replaces Co 2+ at tetragonal sites in the reference spinel and that the increase in lattice constant is due to charge compensation by Co and Mn on the octahedral sites. The results are consistent with those obtained by other investigators [5][6][7][8]. To determine the deviation of the Fe 0.1 Mn 1.45 Co 1.45 O 4 powder obtained via EDTA gel processes after 8 h of calcination in air at 973 K from its nominal composition, its actual composition was determined using XRF.…”
Section: Resultssupporting
confidence: 88%
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“…It is therefore likely that Fe 3+ replaces Co 2+ at tetragonal sites in the reference spinel and that the increase in lattice constant is due to charge compensation by Co and Mn on the octahedral sites. The results are consistent with those obtained by other investigators [5][6][7][8]. To determine the deviation of the Fe 0.1 Mn 1.45 Co 1.45 O 4 powder obtained via EDTA gel processes after 8 h of calcination in air at 973 K from its nominal composition, its actual composition was determined using XRF.…”
Section: Resultssupporting
confidence: 88%
“…The hopping of small polarons is activated by the presence of cations with different valence states at octahedral sites [6][7][8][9]. In this instance, the addition of Fe into Mn 1.5 Co 1.5 O 4 spinel promotes the formation of Fe 3+ , simultaneously inducing the transition of Mn 2+ /Mn 3+ and Mn 3+ /Mn 4+ at octahedral sites [5][6][7][8][9]. Consequently, the hopping activity in the spinel material decreases and so does electrical conductivity [6].…”
Section: Resultsmentioning
confidence: 99%
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“…There have been several attempts to improve the electrical conductivity and tailor the thermal expansion behavior of the (Mn,Co)3O4 spinels by partially substituting Co with Ti [55], Ni [56], Fe [57,58], Cu [59][60][61][62] or Bi [63]. There is consensus that doping with Cu increases both the electrical conductivity and the thermal expansion coefficient [60][61][62]. It has also been reported that Cu-doping lowers the sintering temperature relative to (Mn,Co)3O4 [56,58,59].…”
Section: Introductionmentioning
confidence: 99%