2004
DOI: 10.1016/j.mseb.2004.07.025
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Formation of ultra-shallow p+/n junctions in silicon-on-insulator (SOI) substrate using laser annealing

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Cited by 21 publications
(7 citation statements)
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“…However, the significance of liquids has greatly increased due to the utilization of ultrafast pulsed laser melting techniques in semiconductor processing, enhancing the electrical properties of the material in specific regions. The applications are diverse: initially, laser melting was used to increase the quantity of active dopants and improve the crystal quality of the material during regrowth. Recently, the nonequilibrium regime created by pulsed lasers has also been exploited to achieve conditions of ultradoping and hyper-doping. In these cases, the concentration of active dopants can reach atomic percentages as high as 5–10%, exceeding the crystal solubility limit.…”
Section: Introductionmentioning
confidence: 99%
“…However, the significance of liquids has greatly increased due to the utilization of ultrafast pulsed laser melting techniques in semiconductor processing, enhancing the electrical properties of the material in specific regions. The applications are diverse: initially, laser melting was used to increase the quantity of active dopants and improve the crystal quality of the material during regrowth. Recently, the nonequilibrium regime created by pulsed lasers has also been exploited to achieve conditions of ultradoping and hyper-doping. In these cases, the concentration of active dopants can reach atomic percentages as high as 5–10%, exceeding the crystal solubility limit.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the non-equilibrium segregation during the fast solidification enhances dopant incorporation in the lattice. Thanks to these particular characteristics, laser annealing is nowa-days widely used as a post-fabrication annealing technique in microelectronics [1][2][3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…In this case, it is possible to use inhomogeneity of heterostructure and necessary optimization of doping of electronic materials [12,13] and development of epitaxial technology to improve these materials (including analysis of mismatch induced stress) [14][15][16]. An alternative approach to increase the dimensions of integrated circuits are using of laser and microwave types of annealing [17][18][19].…”
Section: Introductionmentioning
confidence: 99%