Four-point bend adhesion measurements of copper and permalloy systems

Hughey, Michael P.; Morris, Dylan J.; Cook, Robert F.; Bozeman, S. P.; Kelly, Brian; Chakravarty, Swapnajit; Harkens, David P.; Stearns, Laura C.

doi:10.1016/s0013-7944(03)00100-0

Cited by 40 publications

(16 citation statements)

References 22 publications

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“…These include pull-off and peel tests(tape tests [21]), scratch testing [22][23][24][25], four point bend tests [26,27], stressed overlayers [28][29][30] , indentation tests [24,[31][32][33], laser spallation tests [34,35], double cantilever beam tests [36,37] and microcantilever deflection etc. We will start with brief review of the most common techniques before going into more detail about the indentation and scratch tests which are often the only available tests for thin hard coatings.…”

Section: Techniques To Assess Interfacial Toughnessmentioning

confidence: 99%

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

124

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The fundamental property which often dictates the performance of a coating is its adhesion to the substrate and thus there are many techniques to measure adhesion. The choice of methods is dependent on many factors such as the mechanical properties of the coating and substrate, the interface properties, the microstructure of the coating/substrate system, residual stress, coating thickness and the intended application. Most tests aim to introduce a stable interfacial crack and make it propagate under controlled conditions and model this process to determine adhesion. The corresponding models are either stress analysis-based or energy-based. With the advent of miniature systems and very thin functional coatings, there is a need for characterization of adhesion at small length scales and some specific tests have been developed which are not appropriate for thicker coatings. Among these, indentation and scratch methods have the widest range of applicability but it is necessary to analyse the failure mechanisms before choosing an appropriate model to extract adhesion parameters. This paper reviews the main quantitative adhesion tests for coatings and highlights the tests which can be used to assess submicrometre coatings and thin films. The paper also highlights the modelling and analysis methods necessary to extract reliable adhesion properties illustrating this with examples for submicrometre coatings on silicon and architectural glass.

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Section: Techniques To Assess Interfacial Toughnessmentioning

confidence: 99%

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

124

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“…Albeit a rare event, such findings are uncommon in regular 4-point bend delamination test (Ma, 1997 Reimanis et al, 1990Reimanis et al, , 1991Ritchie et al, 1993;Phillipps et al, 1993;Ma et al, 1995Ma et al, , 1997Klingbeil and Beuth, 1997;Dauskardt, et al, 1998;Lane, et al, 2000aLane, et al, , 2000bHasegawa, et al, 2003;Hughey, et al, 2004;Shaviv, et al, 2005), corresponding investigations and experimental results on subcritical crack growth properties are extremely limited (Oh et al, 1988;Cannon et al, 1991;Shaw et al, 1994;McNaney et al, 1996;Hasegawa and Kagawa, 2006;Hirakata, et al, 2006). In this chapter, the dependence of FCG on metal layer thickness in a multi-layer thin film stack is studied.…”

Section: Discussionmentioning

confidence: 95%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and Numerical studies predict that increased constraint and smaller size will accelerate fatigue failure due to changes in plastic deformation. Strain gradients significantly affect the process. Measurements of toughness and fatigue crack growth resistance for the model material system are reported. New test protocols for the commonly used 4 point bend delamination test are developed such that both cracks can be propagated and the number of test data obtained is doubled. The novel approach is also essential for fatigue crack growth. While crack growth resistance was rather independent of the thickness of and fatigue crack growth rates were found to be dependent of film thickness. The dependence of the failure behavior on film thickness arises primarily due to enhanced crack path deflection for decreasing film thickness. Material separation in fracture and fatigue is characterized through a cohesive zone law. The model captures the Paris-law type response obtained in experiments, and also predicts that for thinner films the tendency to crack. Damage tolerant design requires accurate data on residual strength and fatigue crack growth resistance. Both quantities, however, depend on constraint and size of the structure considered. While this has been accounted for in residual strength analysis in the past, the present work provides enabling technologies to solve this problem for fatigue. With the conventional approach to fatigue crack growth, the transferability of data from lab to field, or between specimens and structures is not ensured. Thus, coefficients in the Paris law need to be determined experimentally for each level of constraint or each size of interest. It is, however, not ensured that even a large set of experiments will be able to capture all possible load scenarios. The cohesive zone model approach is provided here as alternative. Once cohesive zone parameters are determined, the dependence of fatigue crack growth on constraint and size emerges as the natural outcome of the analysis without the need to further model modifications. 3

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“…The evaluation of this adhesion was essential to characterize the strength of composite. Several methods were used to quantify the adhesion between the coating and the substrate [9][10][11][12][13][14][15][16][17][18][19][20], including three [9] or four bend tests [10,11], tape and pull-out tests, indentation [12,[13][14][15][16] and scratch techniques [9]. Nevertheless, the accuracy of these methods is compromised by the presence of a third body.…”

Section: Introductionmentioning

confidence: 99%

In-situ SEM study of crack initiation, propagation and interfacial debonding of Ni-P coating during tensile tests: Heat treatment effect

Bouaziz

Brinza

Haddar

et al. 2017

Materials Characterization

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Four-point bend adhesion measurements of copper and permalloy systems

Cited by 40 publications

References 22 publications

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

In-situ SEM study of crack initiation, propagation and interfacial debonding of Ni-P coating during tensile tests: Heat treatment effect

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