FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

Susumago, Yuki; Odashima, Tomo; Ichikawa, Michio; Hanaoka, Hiroki; Kino, Hisashi; Tanaka, Tetsu; Fukushima, Takafumi

doi:10.1109/ectc32696.2021.00017

Cited by 7 publications

(1 citation statement)

References 25 publications

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“…Based on fan-out wafer-level packaging (FOWLP), we have proposed "Smart Skin Display" as a flexible µLED display with wearable vein viewers and sensors consisting of near-IR/red mini-LEDs and a 3D-IC chiplet array on which blue µLEDs are stacked and interconnected with TSV [6]. We call the heterogeneous chiplets "dielets" that involve tiny dies, including optics, MEMS, and passives in addition to standard chiplets [7].…”

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confidence: 99%

Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED

Susumago

Liu

Hoshi

et al. 2023

IEEE Electron Device Lett.

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This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100-μm-cubed blue μLEDs temporarily adhered on a photosensitive resin are interconnected by semi-additive plating (SAP) without thermal compression bonding. By using SAP bonding, a lot of dielets can be stacked on thin 3D-IC chiplets. The following three key technologies are applied to solve the yield issues of SAP bonding. After pick-and-place assembly, additional coplanarity enhancement eliminates Cu bridges grown to a small gap between the μLEDs and photosensitive resin. The μLEDs arrays with sidewalls insulated by room-temperature ozone-ethylene-radical (OER)-SiO2-CVD are successfully bonded on sapphire wafers and a thin 3D-IC with through-Si via (TSV). Further design optimization is required, but partial seed pre-etching works well to increase the yield. Fully integrated module implementation with the 3D-ICs will be the next stage, however, we discuss a superior prospect for yield enhancement toward nearly 100%.

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confidence: 99%