2015 IEEE International Ultrasonics Symposium (IUS) 2015
DOI: 10.1109/ultsym.2015.0514
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FPGA implementation of low-power 3D ultrasound beamformer

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Cited by 8 publications
(4 citation statements)
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“…For example, Sonic Millip3De [45], [46] implements ultra-fast imaging for 128×96 transducer elements (of which only 1024 are considered per shot) with a powerful die-stacked package. Its main bottleneck is that it requires an external DRAM memory to store beamforming delay coefficients, and several GB/s of memory bandwidth.…”
Section: Previous Workmentioning
confidence: 99%
“…For example, Sonic Millip3De [45], [46] implements ultra-fast imaging for 128×96 transducer elements (of which only 1024 are considered per shot) with a powerful die-stacked package. Its main bottleneck is that it requires an external DRAM memory to store beamforming delay coefficients, and several GB/s of memory bandwidth.…”
Section: Previous Workmentioning
confidence: 99%
“…With this index, the contributing sample is selected and summed with matching samples from other channels to obtain the pixel value. Computationally expensive floating-point operations such as the trigonometric and square root functions, multiplication, and division are needed when calculating the indices [50] and calculating these on the fly degrades the system performance. It is preferred to calculate the indices beforehand, store them on the FPGA, and read them directly in operation.…”
Section: Methodsmentioning
confidence: 99%
“…The advanced research platform SARUS [39] supports 1024 receive channels, the highest count supported by any single 3D system, but requires 320 FPGAs. The Sonic Millip3De system [40], [41], that performs ultra-fast imaging, uses 128 × 96 probe elements -but only 1024 channels are considered per shot -with a powerful die-stacked package. However, its main bottleneck is the required external DRAM memory to store the BF delay coefficients, with the need of several GB/s memory bandwidth.…”
Section: Previous Workmentioning
confidence: 99%