Fracture analysis of single crystal manganese zinc ferrites using indentation flaws

Tanaka, Kohichi; Kitahara, Yukina; Ichinose, Yukio; Iimura, Tsutomu

doi:10.1016/0001-6160(84)90228-1

Cited by 20 publications

(8 citation statements)

References 15 publications

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“…Vickers indenter (Akashi Co., MKV-E3), which was employed to evaluate K IC values by the so-called indentation fracture (IF) method. [9][10][11][12][13][14][15] The load was set to be 0.98 N. Surface energies of a series of crystallographic planes parallel to the h001i zone axis were calculated by molecular dynamics (MD). The surface energy s is expressed by eq.…”

Section: Methodsmentioning

confidence: 99%

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Fracture Toughness Evaluated by Indentation Methods and Its Relation to Surface Energy in Silicon Single Crystals

et al. 2003

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Fracture toughness of silicon crystals has been investigated by indentation methods, and their surface energy has been calculated using molecular dynamics (MD). When a conical indenter was forced into a (001) silicon wafer at room temperature, {110} cracks were mainly introduced from the indent, indicating that fracture occurs most easily along the {110} plane among the crystallographic planes of the h001i zone. To confirm this orientation dependence, surface energies for those planes were computed using molecular dynamics. The surface energy calculated exhibits the minimum value of 1.50 JÁm À2 at the {110} plane, and it increases up to 2.26 JÁm À2 at the {100} plane. Fracture toughness was derived from these computed surface energies, and it was shown that K IC value for the {110} crack plane was the minimum among those for the planes of the h001i zone. This result is in good agreement with that obtained by indentation fracture (IF) methods, although the absolute K IC values evaluated by the IF method were larger than those obtained by the calculation.

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Section: Methodsmentioning

confidence: 99%

“…[9][10][11][12][13][14][15] According to Niihara,13) the value of fracture toughness, K IC , is expressed by eq. (4).…”

Section: )mentioning

confidence: 99%

Fracture Toughness Evaluated by Indentation Methods and Its Relation to Surface Energy in Silicon Single Crystals

et al. 2003

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“…The analytical results by Shah and Kobayashi [9] were employed to evaluate the magnification factor for the stress intensity factor. In this case, the residual compressive stress in the surface layer due to initial grinding should also be taken into account as well as the residual tensile stress due to plastic deformation in the indentation [4,5]. Above the stress intensity factor K, at the minimum rate, the growth rate starts to increase.…”

Section: Observation Of Crack Growthmentioning

confidence: 99%

“…The plastic deformation zone formed by a Vickers indentation has been known to generate a residual stress field around an induced crack [4,5]. The residual stress keeps the induced crack open.…”

Section: Analysis Of Indentation-induced Crack Systemmentioning

confidence: 99%

“…Since natural flaws are expected to be simulated by indentation-induced cracks, indentation cracks have been used to determine such properties in cracking behavior as fracture toughness and subcritical crack growth under static loading (for example [1]). On the other hand, the effect of residual stress due to plastic deformation caused by indentation should be taken into account in the strength tests using indented specimens [4,5]. An indentation crack is most convenient as a model crack.…”

Section: Introductionmentioning

confidence: 99%

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Fatigue crack growth from indentation flaw in ceramics

1988

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The indentation crack has been used as a model of surface flaw in the strength tests of ceramics. In evaluation of such strength properties, some attention should be paid to the residual stress effect due to indentation. In this study, fatigue crack growth behavior from indentation flaws was investigated in sintered silicon nitride and alumina. In both materials, a V-shaped behavior was observed in the relation between the maximum stress intensity factor and the crack growth rate. The indentation crack was analyzed using fracture mechanics procedure to take account of the residual component. On the basis of the analysis, an effective stress intensity factor for crack growth was successfully evaluated. The growth rate was correlated to the effective stress intensity factor, and the relation was found to be approximated by a power law equation. The fatigue crack growth property obtained as above was applied to an estimation of fatigue life of specimens without artificial flaws. The flaw size effect was also discussed based on the result,

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Figs. 33 - 66, Tables 4 - 7

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Landolt-Börnstein - Group III Condensed Matter

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Fracture analysis of single crystal manganese zinc ferrites using indentation flaws

Cited by 20 publications

References 15 publications

Fracture Toughness Evaluated by Indentation Methods and Its Relation to Surface Energy in Silicon Single Crystals

Fracture Toughness Evaluated by Indentation Methods and Its Relation to Surface Energy in Silicon Single Crystals

Fatigue crack growth from indentation flaw in ceramics

Figs. 33 - 66, Tables 4 - 7

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