Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system

Wang, Liyuan; Gao, Yufei; Pu, Tianzhao; Yin, Youkang

doi:10.1016/j.engfracmech.2021.107717

Cited by 14 publications

(4 citation statements)

References 36 publications

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“…Note, that the process used to produce fractions of cell may induce new defaults and thus reduce the characteristic fracture stress. [2][3][4][5] Another current trend is to use alternative architectures based on fractions of cells, that is, shingles. 27 However, in PV shingles, the cells are rigidly bonded to one another.…”

Section: Relevance and Practical Consequencesmentioning

confidence: 99%

“…Therefore, the use of fractions of cell is a promising solution to make modules of important curvatures or to reduce stresses within less curved one. Note, that the process used to produce fractions of cell may induce new defaults and thus reduce the characteristic fracture stress 2–5 . Another current trend is to use alternative architectures based on fractions of cells, that is, shingles 27 .…”

Section: Relevance and Practical Consequencesmentioning

confidence: 99%

“…Due to their brittle nature, the level of stress at which they fail is mostly defined by their toughness and the size and orientation of pre‐existing defaults. These defaults are mainly located near cells surfaces and take the form of micro‐grooves of a few tens of microns, which come as a consequence of the sawing process 2–5 . The characteristics and impacts of these defaults are therefore strongly influenced by the surface treatments performed afterwards 6,7 .…”

Section: Introductionmentioning

confidence: 99%

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Photovoltaic integration in curved parts: Mechanical limits and key parameters from a theoretical point of view

Charpentier

Duigou

Chambion

et al. 2023

Progress in Photovoltaics

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Photovoltaic cells are produced as thin flat layers. They behave as a brittle and elastic material that fails at a given level of stress. Conforming cells into curved geometries will a priori induce both flexure and membrane stresses. In the present work, an analytical model is derived to predict both stress distributions and intensities in a mono‐crystalline pseudo‐square cell. Furthermore, a second model is derived to find the main stresses within fractions of cells. For conventional cell dimensions, solutions predict a transition from flexure to membrane dominated stresses for most conformations as curvature increases. As a consequence, near failure stresses are mainly determined by cells size and aspect ratio. In contrast, flexion is the main contribution in a small subset of the curvature space or for small curvatures. In the corresponding cases, stresses scale in proportion to cells thickness. As a consequence, cell size and/or shape is the main parameter to reduce internal stresses in most cases. In particular, the use of fractions of cells can substantially decrease membrane stresses and thus increase the maximum curvature. For instance, in a case study with M0 cells and curvature radii of a few meters, the highest predicted tensile stress is 45 . In such a case, the larger M12 format gives a prediction of . In contrast, thirds of cells give predictions of 25 and , respectively.

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Section: Relevance and Practical Consequencesmentioning

confidence: 99%

Section: Relevance and Practical Consequencesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Photovoltaic integration in curved parts: Mechanical limits and key parameters from a theoretical point of view

Charpentier

Duigou

Chambion

et al. 2023

Progress in Photovoltaics

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show abstract

“…Subsurface cracks can result from various factors, including mechanical stresses, thermal gradients, and material defects. The presence of subsurface cracks significantly reduces the mechanical strength of the wafer and increases the risk of failure during subsequent processing steps or equipment operation [ 144 ]. To improve the surface quality of silicon wafers, various optimization strategies are employed in the processes of fabrication.…”

Section: Machining Performance Of Dwsmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

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Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

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Magnetic-field-assisted abrasive sensing and its deployment in electroplated diamond cutting wires

Ho,

Tsai

2023

Int J Adv Manuf Technol

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Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system

Cited by 14 publications

References 36 publications

Photovoltaic integration in curved parts: Mechanical limits and key parameters from a theoretical point of view

Photovoltaic integration in curved parts: Mechanical limits and key parameters from a theoretical point of view

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Magnetic-field-assisted abrasive sensing and its deployment in electroplated diamond cutting wires

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