Free Convection Heat Transfer from a Totally Enclosed Cabinet Containing Simulated Electronic Equipment

Tierney, J. K.; Koczkur, E.

doi:10.1109/tphp.1971.1136422

Cited by 8 publications

(2 citation statements)

References 2 publications

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“…Forced convection cooling is the main heat dissipation mode of electronic equipment cabinets. This technology uses the air with high production speed of the fan to flow through the heating unit for heat dissipation [3][4] . With the increasing capacity of radar function and processing capacity, the total heat consumption of electronic equipment is getting higher and higher, and the demand for fan pressure and flow is increasing.…”

Section: Introductionmentioning

confidence: 99%

Integrated heat dissipation mechanism design of electronic equipment cabinet based on flow and sound analysis

Jiang,

Chen,

Cai

et al. 2024

J. Phys.: Conf. Ser.

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The electronic equipment cabinet is the main bearing platform of radar back equipment, normally using a forced convection cooling form. With the continuous increase of radar function and processing capacity, the total heat consumption of electronic equipment is getting higher and higher, and the fan speed is constantly increasing. Besides the noise of electronic equipment cabinet shows a trend of gradually increasing. To reduce cabinet noise from the source, this paper presents three structural forms of integrated heat dissipation mechanism, and uses FloEFD fluid heat transfer analysis software and COMSOL acoustic module to analyze the cabinet flow field and the cabinet sound field respectively. By comparing the cabinet noise characteristics under different structural forms, the analysis results show that the noise reduction effect of bilateral air duct structure is best.

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Section: Introductionmentioning

confidence: 99%

Integrated heat dissipation mechanism design of electronic equipment cabinet based on flow and sound analysis

Jiang,

Chen,

Cai

et al. 2024

J. Phys.: Conf. Ser.

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“…The assignability of the homogeneous caloric air temperature on real thermal conditions in switch cabinets is restricted. Tierny and Koczkur [2] showed that the assumption of an average inside temperature distorts the calculation of the heat transport in switch cabinets. Real temperature distributions in the air volume of switch cabinets are not homogeneous, but minted rather multidimensionally.…”

Section: Introductionmentioning

confidence: 99%

Energy Efficient Cooling of Switch Cabinets Using Optimized Internal Settings

Heidemann

Staub

Spindler³

2014

Proceedings of the 15th International Heat Transfer Conference

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The miniaturization progressing of electronic components-used in switch cabinets for manufacturingincreases the packaging density as well as the volumetric dissipation power of the electrical components. As a result, high air temperatures inside the switch cabinets, an overheating and, with that, a reduction in the component life time may result. For this reason, switch cabinets must be cooled actively very often. The commercial CFD code FloTHERM is used to obtain the influence of the packing density of the electrical components, the geometry of the wiring system and the inner air flow on the temperature and the velocity distribution inside a switch cabinet of given size. Based on CFD calculations, measures for optimizing the internal setting of switch cabinets are presented in order to be able to use cooling capacity provided by active cooling devices (e.g. air/air heat exchangers, airconditioning units) as energy efficiently as possible for the avoidance of hotspot areas (areas of a high inside air temperature). For the validation of the CFD model, as well as the verification of the suggested optimizations, experimental data are used. The experimental data are obtained from measurements of temperatures and flow velocities, carried out at a test equipment for switch cabinets in the laboratory. To reproduce the thermal situation inside the tested switch cabinet, empty housings of electronic components are fitted with resistance heaters and installed in the switch cabinet. By a single pulse-width modulated voltage, applied to each resistance heater, a variable distributed overall dissipation power is adjustable. Different steady-state operating conditions of the switch cabinet with natural and forced convection with and without cooled air are investigated. Theoretical results for optimized internal settings of switch cabinets show potential for the conservation of cooling energy up to 23 % compared to the not optimized initial state.

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Packaging

Agajanian¹

1976

Semiconducting Devices

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Free Convection Heat Transfer from a Totally Enclosed Cabinet Containing Simulated Electronic Equipment

Cited by 8 publications

References 2 publications

Integrated heat dissipation mechanism design of electronic equipment cabinet based on flow and sound analysis

Integrated heat dissipation mechanism design of electronic equipment cabinet based on flow and sound analysis

Energy Efficient Cooling of Switch Cabinets Using Optimized Internal Settings

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