1973
DOI: 10.1115/1.3450106
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Free Convection Nusselt Number for Vertical U-Shaped Channels

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Cited by 41 publications
(16 citation statements)
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“…Figure 7a suggests that the optimal spacing between plates falls around 2.875 mm in the present plate-fin array of nonuniform temperature as the heating power is 7 W. Based on the heater temperature that the simulation results yielded at 7 W for the primary handheld projector having plate-fin array, the optimal fin spacing for the plate-fin array would be 3.3 mm and 4.3 mm, estimated by the correlation proposed in [11,14], respectively. The larger optimal spacing that the correlation predicted was because the ambient temperature was defined as the air temperature outside the projector, 303 K, which caused an overestimated Ra number used in both correlations [11,14] since the actual air temperature surrounding the fin array would be considerably higher than 303 K. Similar variation trend of the thermal resistance to the abovementioned case also occurred as the handheld projector was equipped with a pin-fin array as shown in Figure 7a. The thermal resistance slightly reduced as the row of pin fin increased from 7 to 9, which yielded a lowest thermal resistance with the spacing between pins of 3.375 mm, and then gradually increased as the pin row further increased.…”
Section: Figurementioning
confidence: 99%
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“…Figure 7a suggests that the optimal spacing between plates falls around 2.875 mm in the present plate-fin array of nonuniform temperature as the heating power is 7 W. Based on the heater temperature that the simulation results yielded at 7 W for the primary handheld projector having plate-fin array, the optimal fin spacing for the plate-fin array would be 3.3 mm and 4.3 mm, estimated by the correlation proposed in [11,14], respectively. The larger optimal spacing that the correlation predicted was because the ambient temperature was defined as the air temperature outside the projector, 303 K, which caused an overestimated Ra number used in both correlations [11,14] since the actual air temperature surrounding the fin array would be considerably higher than 303 K. Similar variation trend of the thermal resistance to the abovementioned case also occurred as the handheld projector was equipped with a pin-fin array as shown in Figure 7a. The thermal resistance slightly reduced as the row of pin fin increased from 7 to 9, which yielded a lowest thermal resistance with the spacing between pins of 3.375 mm, and then gradually increased as the pin row further increased.…”
Section: Figurementioning
confidence: 99%
“…In addition, the heat transfer coefficient of a surface with identical surface temperature and dimensions to the aforementioned surface in the plate-fin array in the study was also estimated using several selected correlations. Those selected correlations are applicable for the estimation of the heat transfer coefficient of either a vertical, single plate [3,4,6] or a plate-fin array [9,11,18] in an infinite, still medium. Figure 6 demonstrates the comparison of the heat transfer coefficient among those data.…”
Section: Figurementioning
confidence: 99%
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“…If 41 < Ta < 100 (Our model: 79.5), the flow takes on a vertex form and Eq. (12) has to be used to calculate Nu [8]. …”
Section: Analysis Of Forced Convection (Air Gap)mentioning
confidence: 99%
“…Elenbaas [2] was the first to create a detailed study on heat sink fins. Instead, Starner and McManus [3], Welling and Wooldridge [4] carried out several experimental studies, while Van de Pol and Tierney [5] developed a correlation with Welling and Woolridge's experimental results. Finally, Bilitsky [6] has carried out a complete parametrical analysis of heat sinks in relation to the height and thickness of the fins.…”
Section: Introductionmentioning
confidence: 99%