In the various areas in which electrical components are used, the problem of heat dissipation generated due to the absorption of electrical energy assumes great interest and is worthy of an in-depth study. In steady state conditions, the thermal power generated can equal the electrical power absorbed and leads to an alteration in the physical properties of electrical components compromising their performance and correct functioning. One of the most frequently adopted solutions consists in the application of a heat sink on the surface to be cooled. Experimental tests were conducted using an infrared thermal camera, an internal climate control unit for the recording of the thermo hygrometric conditions of the environment and a finite element software (ProENGINEER) to simulate the thermal behaviour of the heat sink in order to analyse the modalities of thermal exchange of the heat sink. The results obtained were subsequently compared with the heat sink properties provided by the manufacturer. The main objective of the work is that of providing a methodology that blends the use of thermographic and simulation techniques with finite elements, in order to render the development of a theoretical-experimental correlation possible for any physical condition and geometrical configuration taken into consideration. This methodology is confirmed in the field of technological development of electrical components, where at each stage of the planning process exists a marked intertwining of computing, electronics, mechanics and heat transmission.