2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE 2017
DOI: 10.1109/emceurope.2017.8094780
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Frequency domain simulation of conducted EMI in power electronic converters considering internal near field couplings by FEM

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Cited by 9 publications
(5 citation statements)
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“…The researchers studied the multi-physics, which are (Magnetic fields and Laminar Flow) in the three areas: First: coil geometry analysis [33,34], Second: stationery [35][36][37][38], and Third: frequency domain [39][40][41][42].…”
Section: Methodsmentioning
confidence: 99%
“…The researchers studied the multi-physics, which are (Magnetic fields and Laminar Flow) in the three areas: First: coil geometry analysis [33,34], Second: stationery [35][36][37][38], and Third: frequency domain [39][40][41][42].…”
Section: Methodsmentioning
confidence: 99%
“…The voltage rise time of the switching device and the size and shape of the load circuit affect EMI to a large extent. In the research on radiation modeling of components, it is necessary to first establish the three-dimensional models of capacitors and inductors in CST software (Takahashi et al, 2017), and use finite element simulation to achieve threedimensional electromagnetic field modeling and radiation characteristic analysis of circuit components. The effect of nearfield radiated interference generated by components on the performance of EMI filters can be analyzed using the frequency domain solver of CST.…”
Section: Modeling Of Radiated Emimentioning
confidence: 99%
“…From Fig. 1 (b), the parasitic capacitance resulting from the insulating layer (SiN) in the tested SiC power module is obtained by (4). Here, S is parallel plates of area, d is separation distance and is the dielectric permittivity.…”
Section: A Operating Condition Of Dc-dc Buck Convertermentioning
confidence: 99%
“…There has been increasing interest in predicting and suppressing EMI of SiC-based power conversion circuit to suffice the electromagnetic compatibility (EMC) regulations (e.g., CISPR and FCC). Many papers and technical reports mention that it is important to identify parasitic inductance around the power devices in the circuit [3][4][5][6]. The authors have evaluated parasitic inductance of interconnect wiring and visualized high-frequency noise current distribution in 2-D structure SiC half-bridge power module [7].…”
Section: Introductionmentioning
confidence: 99%