Frequency-scaled thermal-aware test scheduling for 3D ICs using machine learning based temperature estimation

Impact of Gate-Level Clustering on Automated System Partitioning of 3d-Ics

“…There are still many challenges to overcome [3], such as tools used for automated 3D design place and route (P&R) and optimizations, and 3D-IC characterization: power, thermal, IR-drop, electromigration, mechanical analysis, etc. [4,5] To overcome the absence of true 3D physical implementation tools, academia and industry typically trick the existing 2D tools. An example of such 3D flow, based on commercial quality tools, is the "Die-by-Die" flow [6], where each die is processed individually, in a sequence.…”