“…Furthermore, when passive BPFs are realized with IC-based resonators, they exhibit high levels of IL (IL ∼ 4.5-9.3 dB in [14], [15]). To reduce the size of the non-reciprocal devices and BPFs, two major miniaturization approaches have been investigated: i) the integration of the non-reciprocal components into a chip using MMIC, CMOS, SiGe, technologies [16], [17], [18], [19], [20], [21], [22], [23], [24], [25], [26], [27], [28], [29] and ii) the RF co-design of the non-reciprocal components with the BPFs with or without ferrite-based elements [31], [32], [33], [34], [35], [36], [37], [38], [39], [40], [41], [42], [43], [44].…”