From Chlorinated Solvents to Branched Polyethylene: Solvent‐Induced Phase Separation for the Greener Processing of Semiconducting Polymers

Wu, Yunyun; Ocheje, Michael U.; Mechael, Sara S.; Wang, Yunfei; Landry, Eric; Gu, Xiaodan; Xiang, Peng; Carmichael, Tricia Breen

doi:10.1002/aelm.202100928

Cited by 3 publications

(3 citation statements)

References 41 publications

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“…As shown in table 1, devices prepared from P(DPP-T) all showed good characteristics and transfer behavior. For the devices characterized after thermal annealing at 60 • C, an average charge mobility of 0.0138 cm 2 Vs −1 was measured, with an I on /I off of 10 4 and V th of −1.2 V. These results are comparable to previously reported charge mobilities for this polymer measured in TCBG OFETs on SiO 2 /Si++ substrate with an octadecyltrichlorosilane self-assembled monolayer [37,41]. Upon thermal annealing to 100 • C, the devices showed a similar charge mobility (0.023 cm 2 Vs −1 ) and on/off ratio.…”

Section: Evaluating Shellac As a Dielectric Materials In Ofet Devices...supporting

confidence: 85%

“…However, to achieve the use of shellac on paper substrates, this initial investigation on silicon wafer is crucial to establish the fabrication procedures and confirm the compatibility of shellac with other device components. For this initial investigation, two DPP-based polymers, namely P(DPP-T) and P(DPP-TVT) were used as the semiconductor material and prepared following previously reported procedures [35][36][37]. P(DPP-T) was chosen given its low Young's modulus and high solubility (ease of processing) and P(DPP-TVT) was selected due to its high charge-carrier mobility in OFETs.…”

Section: Evaluating Shellac As a Dielectric Materials In Ofet Devices...mentioning

confidence: 99%

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Shellac as dielectric materials in organic field-effect transistors: from silicon to paper substrates

Skaf,

Gomes,

Majidzadeh

et al. 2023

Flex. Print. Electron.

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Recent advances in the design and preparation of electroactive materials, particularly semiconducting and conductive polymers, have resulted in the creation of novel organic electronics with advanced functionality and performance competitive with that of devices made of silicon. With an increasing number of organic and printed electronics being engineered and produced at a larger scale, the environmental cost of the final organic electronic devices (life cycle, environmental impact, etc.) needs to be considered. While e-waste is already a growing global problem, improving the sustainability of emerging electronics through a careful materials selection is highly desirable. In this work, we explore the use of shellac as a sustainable greener dielectric material in organic field-effect transistors (OFET). A careful examination of shellac in combination with diketopyrrolopyrrole-based semiconducting polymers was performed on rigid substrates through AFM and the fabrication of thin film transistors. All devices made from this green dielectric showed good performance and device characteristics. Building from this investigation, shellac was further integrated with paper substrates to fabricate paper-based thin film transistors. Thin film samples based on shellac on both silicon wafer and paper substrates were characterized by atomic force microscopy to investigate solid-state morphology of shellac and selected semiconducting materials. Through careful optimization of the device architecture and processing time, device characteristics and performances on paper substrates (average charge mobilities and on/off current ratios) were comparable to those of devices prepared on silicon wafers, confirming that shellac, in combination with organic semiconducting polymers, can be an advantageous dielectric material to be used for the fabrication of greener and sustainable thin film electronics from renewable feedstocks and components.

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Section: Evaluating Shellac As a Dielectric Materials In Ofet Devices...supporting

confidence: 85%

Section: Evaluating Shellac As a Dielectric Materials In Ofet Devices...mentioning

confidence: 99%

Shellac as dielectric materials in organic field-effect transistors: from silicon to paper substrates

Skaf,

Gomes,

Majidzadeh

et al. 2023

Flex. Print. Electron.

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“…Examples of printed devices include printed antennas, , sensors, and displays , for applications in inventory and package tracking, antitheft and counterfeiting, food quality monitoring, , and pharmaceutical dose tracking . The extensive applicability and short lifetime of smart packaging will profoundly accelerate an already mature electronic waste (e-waste) problem. − Research efforts have focused on developing green conductive inks and ink processing alternatives; however, poly(ethylene terephthalate) (PET) has dominated as the substrate of choice for printed electronics because of its smoothness and flexibility, despite its substantial contribution to the weight of a printed device and its environmental persistence. ,,− Paper is a promising green substrate for disposable electronics: It is sourced from renewable materials, is biodegradable, and has established recycling procedures. Paper is significantly lower cost (∼10 cents/m 2 ) compared to PET (∼2 dollars/m 2 ), it is compatible with high-throughput roll-to-roll (R2R) printing, and it can also withstand higher processing temperatures than plastic substrates .…”

Section: Introductionmentioning

confidence: 99%

Debossed Contact Printing as a Patterning Method for Paper-Based Electronics

Mechael,

D’Amaral,

Carmichael

2023

ACS Appl. Mater. Interfaces

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The proliferation of printed electronic devices is feeding the growth of the Internet of Things, with devices deployed everywhere to collect and communicate data. At the same time, the increase in low-cost disposable devices is a cause for serious environmental concern. In particular, widely used plastic substrates such as poly(ethylene terephthalate) are persistent hazards to the environment. Paper is promising as a greener substrate for printed electronics because it is biodegradable and sourced from renewable materials as well as being low cost and compatible with roll-to-roll printing. However, the porous microstructure of paper promotes wicking of functional inks, leading to poor electrical performance and printing resolution. Hydrophobic coatings applied to the surface of paper create a planarized, printable surface, but these materials may compromise biodegradability and/or recyclability. This paper describes a new resist-free patterning method for printed paperbased electronics that takes advantage of the porous structure of paper. Debossed contact printing uses the pressure from a debossing tip to compress the porous structure of paper and create a patterned relief structure. Printing functional inks with an unpatterned roller deposits ink only on the raised regions of the relief structure. We demonstrate debossed contact printing of silver, carbon black, and conducting polymer inks and show that this new fabrication method is suitable for the fabrication of printed devices with dense features. We demonstrate the fabrication of antennas and patterned electrodes for RFID and smart wallpaper applications, respectively.

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Polyethylene and Semiconducting Polymer Blends for the Fabrication of Organic Field-Effect Transistors: Balancing Charge Transport and Stretchability

Kulatunga

Yousefi

2022

Chemosensors

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Polyethylene is amongst the most used polymers, finding a plethora of applications in our lives owing to its high impact resistance, non-corrosive nature, light weight, cost effectiveness, and easy processing into various shapes from different sizes. Despite these outstanding features, the commodity polymer has been underexplored in the field of organic electronics. This work focuses on the development of new polymer blends based on a low molecular weight linear polyethylene (LPE) derivative with a high-performance diketopyrrolopyrrole-based semiconducting polymer. Physical blending of the polyethylene with semiconducting polymers was performed at ratios varying from 0 to 75 wt.%, and the resulting blends were carefully characterized to reveal their electronic and solid-state properties. The new polymer blends were also characterized to reveal the influence of polyethylene on the mechanical robustness and stretchability of the semiconducting polymer. Overall, the introduction of LPE was shown to have little to no effect on the solid-state properties of the materials, despite some influence on solid-state morphology through phase separation. Organic field-effect transistors prepared from the new blends showed good device characteristics, even at higher ratios of polyethylene, with an average mobility of 0.151 cm2 V−1 s−1 at a 25 wt.% blend ratio. The addition of polyethylene was shown to have a plasticizing effect on the semiconducting polymers, helping to reduce crack width upon strain and contributing to devices accommodating more strain without suffering from decreased performance. The new blends presented in this work provide a novel platform from which to access more mechanically robust organic electronics and show promising features for the utilization of polyethylene for the solution processing of advanced semiconducting materials toward novel soft electronics and sensors.

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From Chlorinated Solvents to Branched Polyethylene: Solvent‐Induced Phase Separation for the Greener Processing of Semiconducting Polymers

Cited by 3 publications

References 41 publications

Shellac as dielectric materials in organic field-effect transistors: from silicon to paper substrates

Shellac as dielectric materials in organic field-effect transistors: from silicon to paper substrates

Debossed Contact Printing as a Patterning Method for Paper-Based Electronics

Polyethylene and Semiconducting Polymer Blends for the Fabrication of Organic Field-Effect Transistors: Balancing Charge Transport and Stretchability

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