2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC) 2018
DOI: 10.1109/aspdac.2018.8297397
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From silicon to printed electronics: A coherent modeling and design flow approach based on printed electrolyte gated FETs

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Cited by 17 publications
(7 citation statements)
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“…1b. EGTs operate at low voltages (≤2.0 V) and show circuit performances ranging from several hundreds of Hz until kHz [57][58][59][60] . Studies on EGT variations and device variation modeling have also been studied prior to this work 61,62 .…”
Section: Resultsmentioning
confidence: 99%
“…1b. EGTs operate at low voltages (≤2.0 V) and show circuit performances ranging from several hundreds of Hz until kHz [57][58][59][60] . Studies on EGT variations and device variation modeling have also been studied prior to this work 61,62 .…”
Section: Resultsmentioning
confidence: 99%
“…Gravure printing is among the most relevant technologies for the production of flexible and low-cost printed electronics, due to its high-speed, high-throughput, high-resolution deposition of functional materials and compatibility with roll-to-roll processes [42][43][44]. As depicted in Figure 3a, the technique relies on the transfer of ink from small engraved cells in the gravure cylinder to the flexible substrate in three steps: (1) filling (cavities are overfilled with ink by ink bath or chambered doctor blade); (2) wiping (removal of excess ink from the non-image areas using doctor blade); (3) transferring (the moving substrate contacts the free surface of the ink in the well, and ink is pulled from the well onto the substrate). The quality of the printing is governed by the wettability of the ink to the printing plate, doctor blade, and substrate [45].…”
Section: Gravure Printingmentioning
confidence: 99%
“…The manufacturing strategies for conventional silicon-based technologies are based on photolithographic and chemical processing steps, allowing for the realization of electronic circuits on wafers made of pure semiconducting material. Albeit well-established, these methods suffer from lack of flexibility, high costs, and a limited range of materials that can be processed [1]. In this regard, the employment of printing technologies constitutes an important alternative, due to the ease of fabrication, design flexibility, compatibility with flexible substrates, and excellent control of electrical, optical, and magnetic properties of the printed materials.…”
Section: Introductionmentioning
confidence: 99%
“…The later discussed circuit properties can be deduced on the basis of the transistor properties. [16,[41][42][43] To achieve high performance EGFETs, the indium oxide films need to be annealed at temperatures around 400 °C. In the past, it has been shown that these EGFETs perform reliably over a wide temperature range.…”
Section: Electrolyte-gated Field-effect Transistors Based On Indium Omentioning
confidence: 99%
“…[40] The EGFETs were also successfully modeled and integrated into a process design kit (PDK), which supports the circuit design flow. [16,[41][42][43] To achieve high performance EGFETs, the indium oxide films need to be annealed at temperatures around 400 °C. [44] By using chemical or photonic curing methods, the indium oxide film can be cured also at room temperatures.…”
Section: Electrolyte-gated Field-effect Transistors Based On Indium Omentioning
confidence: 99%