Abstract:Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for complex multi-processor System-On-Chips (SOC). Such structures utilize short vertical interconnects in 3D ICs together with scalability of NOC to improve performance of communications in SOCs. By scaling trends in 3D integration, probability of fault occurrence increases that leads to low yield of links, especially TSV-based vertical links in 3D NOCs. In this paper, FT-Z-OE (Fault Tolerant Z Odd-Even) routing, a dis… Show more
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