Fully elastic interconnects on nanopatterned elastomeric substrates

Mandlik, Prashant; Lacour, Stéphanie; Li, J.W.; Chou, Stephen Y.; Wagner, S.

doi:10.1109/led.2006.879029

Cited by 45 publications

(37 citation statements)

References 7 publications

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“…As compared to the simplified models available in the literature 37,38 Eq. 1 was found to best fit the experimental data with a coefficient of determination (K 2 ) of 0.994.…”

Section: Stretchable Behavior Of Esd-deposited Ag Films On Low Modulumentioning

confidence: 99%

Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition

Mehdi

Cho

Kang

et al. 2015

Journal of Elec Materi

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This paper investigates the fabrication of Ag films through the electrospray deposition (ESD) technique on sub-millimeter-thick acid-etched rough polydimethylsiloxane (PDMS) substrates having both low and high modulus of elasticity. The main focus of the study is on the stretchable behavior of ESDdeposited Ag nanoparticles-based thin films on these substrates when subjected to axial strains. Experimental results suggest that the as-fabricated films on thin acid-etched rough low modulus PDMS has an average stretchability of 5.6% with an average increase in the resistance that is 23 times that of the initial resistance at electrical failure (complete rupture of the films). Comparatively, the stretchability of Ag films on the high modulus PDMS was found to be 3 times higher with 4.65 times increase in the resistance at electrical failure. Also, a high positive value of the piezoresistive coefficient for these films suggests that the resistivity changes during stretching, and thus deviation from the simplified models is inevitable. Based on these results, new models are presented that quantify the changes in resistance with strain.

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“…As compared to the simplified models available in the literature 37,38 Eq. 1 was found to best fit the experimental data with a coefficient of determination (K 2 ) of 0.994.…”

Section: Stretchable Behavior Of Esd-deposited Ag Films On Low Modulumentioning

confidence: 99%

Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition

Mehdi

Cho

Kang

et al. 2015

Journal of Elec Materi

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“…In the last decade, a high number of technologies to realize conformable electronic systems have been developed by a number of research institutes [1][2][3][4][5][6][7][8]. A wide variety of different processes exists nowadays to realize such systems, where each technology has its own particular characteristics and targeted application fields.…”

Section: Introductionmentioning

confidence: 99%

Plastic electronics based conformable electronic circuits

Bossuyt

Dunphy

Vanfleteren

et al. 2012

2012 4th Electronic System-Integration Technology Conference

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In this contribution, results on technology developments are presented aiming to realize conformable electronic systems based on plastic electronics technologies. Focus of the developments is on low cost with an acceptable reliability in function of the end-application. The feasibility of this technology is demonstrated by digging into the different process steps and their characteristics. A number of demonstrators (large-area conformable illumination tiles) have been realized and are discussed. The major part of this contribution is on the mechanical characterization of these plastic electronics based technologies. IntroductionIn the last decade, a high number of technologies to realize conformable electronic systems have been developed by a number of research institutes [1][2][3][4][5][6][7][8]. A wide variety of different processes exists nowadays to realize such systems, where each technology has its own particular characteristics and targeted application fields. Each technology has its advantages and disadvantages in terms of processability, reliability, scalability and cost.In this contribution, we discuss a technology with the aim to realize roll-to-roll, large area conformable systems mainly for lighting applications situated in the consumer health market and design industry. Substrate materials like PET/PEN in combination with printed (e.g. silver paste) or etched (e.g. from laminated copper foil) meandering metal structures are used as starting point. The foils obtain their conformability by structuring them using laser technology.

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“…Therefore it is critical that the strain in brittle device layers is reduced below the value at which cracking is initiated. Methods of reducing the strain experienced by device layers include preventing the propagation of cracks through the device layers through nano-patterning [7,8], reducing the strain in layers below the fracture limit of the material by patterning islands [9,10] or shifting the critical device layers closer to the neutral bending plane [11,12].…”

Section: Introductionmentioning

confidence: 99%

Designing micro-patterned Ti films that survive up to 10% applied tensile strain

et al. 2010

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Reducing the strain in brittle device layers is critical in the fabrication of robust flexible electronic devices. In this study, the cracking behavior of micro-patterned 500-nm-thick Ti films was investigated via uniaxial tensile testing by in situ SEM and 4-point probe measurements. Both visual observations by SEM and 4-pt resistance measurements showed that strategically patterned oval holes, off-set and rotated by 45°, had a significant effect on limiting the extent of cracking, specifically, in preventing cracks from converging. Failure with regard to electrical conduction was delayed from less than 2% to more than 10% strain.

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Fully elastic interconnects on nanopatterned elastomeric substrates

Cited by 45 publications

References 7 publications

Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition

Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition

Plastic electronics based conformable electronic circuits

Designing micro-patterned Ti films that survive up to 10% applied tensile strain

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